WMSIC Electronic Components

Xinglight XL-2810UGC LED XL-2810UGC

ModelXL-2810UGC
PackageSMD,3.5x1.4mm
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-2810UGC
Type
XINGLIGHT
Minimum package
3000

Technical parameters

Power
70mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-2810UGC
Electronic Component
1
Package
SMD,3.5x1.4mm
Electronic Component
515nm~530nm
Electronic Component
LEDDiode / LED
Electronic Component
0.035g
Electronic Component
1
LED
2.6cd
LED
120°
LED
Electronic Component
Electronic Component
BM0259344265
Electronic Component
520nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-2810UGC 315 翠绿 贴片发光二极管产品概述

一、产品简述

XL-2810UGC 315 为Xinglight(成兴光)出品的一款高亮度翠绿色贴片发光二极管(SMD)。封装尺寸约为3.5 × 1.4 mm,独立二极管设计,采用无色透明透镜和120°宽视角,适合作为指示、背光和小型显示单元的光源。工作温度范围为-40℃至+85℃,载带方式为侧贴,方便自动贴装与量产使用。

二、主要光电参数

  • 发光颜色:绿色(翠绿)
  • 峰值波长:520 nm;波长范围:515–530 nm
  • 正向电压(Vf):2.8–3.4 V(典型值视出货批次而定)
  • 正向电流(If):20 mA(额定)
  • 功率耗散:70 mW(典型器件功率等级)
  • 发光强度:2.6 cd(典型,If = 20 mA)
  • 发光角度:120°
  • 二极管配置:独立二极管(单体发光)

三、产品特性与优势

  • 高显色性:以520 nm峰值为中心的翠绿色,颜色纯正,视觉识别度高。
  • 宽视角:120°出光角度,使面光或大面积指示更均匀。
  • 小型化封装:3.5 × 1.4 mm SMD 封装,适合空间受限的产品布局。
  • 工业级温度范围:-40℃~+85℃,适应多种环境工况。
  • 自动贴装兼容:侧贴载带方式,适配常见贴片机与回流焊工艺。

四、典型应用场景

  • 消费类电子产品指示灯(机顶盒、路由器、家电面板)
  • 嵌入式设备与工控面板状态指示
  • 仪器仪表和医疗设备的指示灯/背光元件
  • 小型标识与交通设备指示模块
  • 汽车内饰非关键指示(需结合车规认证确认使用)

五、使用与电路建议

  • 电流驱动:推荐工作电流为20 mA,长时间使用可根据寿命需求适当降流以延长寿命。
  • 限流电阻计算举例:以5 V供电、取Vf典型值3.2 V为例,R ≈ (5.0 − 3.2) / 0.02 ≈ 90 Ω,功率约为 (5.0 − 3.2) × 0.02 = 0.036 W。实际设计请依据系统电压与器件标称Vf调整并留有余量。
  • 驱动方式:推荐恒流驱动或恒流源芯片,避免长时间在高电压下直接限阻驱动产生较大波动。
  • PCB布线:为保证热散与光学一致性,建议在焊盘区域采用适当的铜箔与过孔散热设计,并保证透光方向无遮挡。

六、封装、贴装与可靠性注意事项

  • 封装:SMD 形式,尺寸3.5 × 1.4 mm,透明透镜。
  • 贴装:适配侧贴载带,支持常规回流焊流程。建议在贴装与回流前后采取防静电与防潮措施(推荐按湿敏等级处理)。
  • 可靠性:工作与储存环境应避免超过规定温度范围及机械冲击;长期高温或过流工作会加速光衰与寿命衰减。为实现长期稳定性,建议在设计阶段考虑降额使用(如降低驱动电流或控制结温)。

七、采购与技术支持

XL-2810UGC 315 为成兴光(Xinglight)标准产品,适合批量采购与SMT自动化生产。需要更详细的光电曲线、焊接热特性或可靠性数据时,可联系供应商索取完整数据手册与样片进行评估验证。

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