WMSIC Electronic Components

Xinglight XL-0201UYC

ModelXL-0201UYC
Package201
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-0201UYC
Type
XINGLIGHT
Minimum package
5000 编带

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-0201UYC
Electronic Component
1
Package
201
Electronic Component
582.5nm~595nm
Electronic Component
LEDDiode / LED
Electronic Component
0.013g
Electronic Component
1
LED
135mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0230032121
Electronic Component
588nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-0201UYC 0201 黄色贴片发光二极管 产品概述

一、产品简介

XL-0201UYC 是 Xinglight(成兴光)推出的一款超小型 0201 封装黄色贴片发光二极管(SMD LED)。该器件采用无色透明透镜设计,提供宽广的出光角和稳定的黄色光谱,适合对体积、功耗和外观有严格要求的微型指示与显示类应用。器件工作温度范围宽,可在-40℃至+85℃环境中长期可靠工作。

二、主要性能参数

  • 发光颜色:黄色
  • 峰值波长:588 nm
  • 波长范围:582.5 nm ~ 595 nm
  • 正向压降(Vf):1.7 V ~ 2.3 V
  • 额定正向电流(If):5 mA
  • 最大功率耗散:50 mW
  • 发光强度(Iv):约 135 mcd(典型)
  • 发光角度:120°(广角)
  • 封装:0201 SMD,透明透镜
  • 载带方式:正贴(适合带装撒布与贴片机)
  • 工作温度:-40℃ ~ +85℃

注:标注的光电参数为典型/额定值,实际应用中应参考厂方完整数据手册并考虑量产筛选条件。

三、光电特性说明

XL-0201UYC 在额定驱动电流处提供饱满的黄色光输出,峰值 588 nm 属于人眼对黄色响应较好的波段,视觉亮度感较高。无色透明透镜与 120° 宽发光角设计,使得器件在微小封装下仍能实现均匀的漫射指示效果,适合面板指示、图标背光或多点状态显示。

正向压降随电流和温度变化,给出范围 1.7–2.3 V,电路设计应以最大 Vf 值和允许误差来选配限流元件以保证可靠性。器件额定功率 50 mW 远大于在 5 mA 驱动下的实际耗散(P ≈ Vf × If),有利于降低热应力。

四、封装与机械信息

0201 封装尺寸极小,适用于高密度 SMT 贴装。透明透镜外观利于实现高对比度的小型指示点。常见供料方式为卷带(载带正贴),兼容常规贴片机取放。由于尺寸极小,PCB 的焊盘设计、贴装精度与回流温度曲线需按厂方推荐的 land pattern 与工艺文件执行,以保证焊点可靠性与光学一致性。

五、可靠性与应用建议

  • 典型应用:微型指示灯、微型穿戴设备、移动设备指示、IoT 端节点、医疗检测仪器指示、状态信号、精密仪表背光。
  • 温度与寿命:在推荐驱动条件和环境温度范围内使用可获得较长寿命。高温或过流会加速光衰与封装损伤,应避免过载。
  • ESD 防护:LED 对静电敏感,装配与测试过程中应采取 ESD 防护措施(佩戴接地手环、使用防静电台垫等)。

六、安装与焊接注意事项

  • 推荐使用标准 SMT 回流焊工艺,遵循 PCB 制程的回流温度曲线。0201 尺寸器件对焊接热敏感,避免重复高温循环。
  • 贴装时避免过度压力或针脚式直接接触透镜,以免造成机械损伤或光学偏移。
  • 清洗:若需清洗,选择对封装和胶粘剂安全的溶剂与工艺,避免长时间浸泡。
  • 存储与搬运:避免受潮与紫外直射,保存于干燥带或密封包装中,必要时进行烘烤去湿处理(遵循厂方建议)。

七、典型驱动电路与限流电阻计算

XL-0201UYC 常用简单恒流限制方式驱动。若采用串联限流电阻,计算公式为: R = (Vcc − Vf) / If

举例(取 If = 5 mA):

  • 当 Vcc = 5 V,取 Vf 最大 2.3 V:R = (5.0 − 2.3) / 0.005 = 540 Ω → 取 560 Ω 标准值。
  • 当 Vcc = 3.3 V,取 Vf 最小 1.7 V:R = (3.3 − 1.7) / 0.005 = 320 Ω → 取 330 Ω 标准值。

限流电阻功率 Pd = (Vcc − Vf) × If,例如 5 V 情况下 Pd ≈ (5.0 − 2.3) × 0.005 = 0.0135 W(选择常见 1/8 W 或更高功率电阻安全裕量)。实际设计可采用恒流驱动器以获得更稳定的亮度一致性和更佳的电流控制。

总结:XL-0201UYC 以极小体积、宽视角和稳定的黄色光学特性,为微型指示与高密度应用提供可靠选择。在设计与量产时,请结合厂方完整规格书和 PCB 工艺规范进行焊接、驱动与可靠性验证。若需更详细的机械尺寸图、回流曲线或色彩数据图谱,请索取 Xinglight 的产品数据手册与可靠性报告。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.