WMSIC Electronic Components

Xinglight XL-3216SURC-FB

ModelXL-3216SURC-FB
Package1206
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-3216SURC-FB
Type
XINGLIGHT
Minimum package
3000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-3216SURC-FB
Electronic Component
1
Package
1206
Electronic Component
620nm~625nm
Electronic Component
LEDDiode / LED
Electronic Component
0.028g
Electronic Component
1
LED
120mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0225276005
Electronic Component
620nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-3216SURC-FB 1206 红色贴片发光二极管 — 产品概述

一、产品简介

XL-3216SURC-FB 是成兴光(Xinglight)推出的一款高性价比 1206(公制 3216)封装红色贴片发光二极管。器件采用无色透明透镜和宽视角设计,光色稳定、发光均匀,适用于各种面板指示、背光与状态显示场景。载带为反贴(便于贴装机取料),适配自动化 SMT 生产线。

二、主要技术参数

  • 型号:XL-3216SURC-FB
  • 封装:1206(3216 尺寸)
  • 发光颜色:红色
  • 波长范围:620 nm ~ 625 nm(峰值波长 620 nm)
  • 正向电流(If):20 mA(典型工作电流)
  • 发光强度:120 mcd(在指定 If 下典型值)
  • 正向压降(Vf):2.3 V(典型)
  • 功率:50 mW(最大耗散功率或推荐功率范围)
  • 发光角度:120°(宽视角)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 载带方式:反贴(reverse tape)
  • 透镜颜色:无色透明透镜

三、光电特性说明

该器件在典型正向电流 20 mA 下,峰值波长集中于 620 nm,呈现纯正红色光。120° 的发光角度使光分布宽广、均匀,适合做指示灯与近距离背光应用。发光强度 120 mcd 为常见可视化指示亮度,能在中等环境光下保持良好可见性。

四、封装与机械特性

1206 封装(公制 3216)体积小、便于高密度安装。无色透明透镜有助于色彩呈现的纯净度与亮度一致性。反贴载带适配大多数贴片机的取料方向,请在贴片前确认料带方向与贴装机设置匹配,避免翻转导致极性错误或取料失败。

五、环境适应性与可靠性

器件额定工作温度为 -40 ℃ 至 +85 ℃,能够满足工业级温度要求。为确保长期可靠性,应控制工作电流与功率在规格范围内,避免长时间超额驱动引起热累积。器件对静电敏感,生产与维修过程中应采取 ESD 防护措施。

六、典型应用场景

  • 面板与仪表的状态指示灯
  • 家电与消费电子的功能指示(如电源、工作状态)
  • 键盘背光、按钮指示
  • 工业控制设备的信号指示
  • 汽车内饰非安全关键指示(需满足汽车认证时请确认相应规格)

七、使用与焊接建议

  • 建议采用兼容 SMT 的无铅回流焊工艺,遵循器件厂商或标准无铅回流曲线,控制峰值温度和在高温区的停留时间以避免热损伤。
  • 焊盘设计参考 1206 封装推荐尺寸,保证焊点可靠性与散热性。
  • 点亮驱动建议在限流电阻或恒流驱动下工作:例如在 5 V 电源下,若 Vf ≈ 2.3 V、目标 If = 20 mA,则限流电阻 R ≈ (5 − 2.3) / 0.02 ≈ 135 Ω(常用取值 150 Ω)。实际设计请考虑容差与温度变化。
  • 存储建议:干燥防潮保存,长时间暴露在高湿环境前建议回烘以防止吸湿。

八、注意事项

  • 请确认正负极极性后再贴装与焊接,避免反向电压损坏器件。
  • 严禁在超出规格的电流或反向电压下工作,避免功率过载造成失效。
  • 如用于关键安全场合或需特殊认证(如汽车级、军工级),请与厂家确认详细可靠性与认证资料。

如需更详细的封装尺寸图、回流焊推荐曲线或光电特性曲线(IV、IVL、光谱曲线等),可联系成兴光(Xinglight)获取器件数据手册与样品支持。

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