WMSIC Electronic Components

Xinglight XL-1608UVC-04

ModelXL-1608UVC-04
Package603
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-1608UVC-04
Type
XINGLIGHT
Minimum package
4000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-1608UVC-04
Electronic Component
1
Package
603
Electronic Component
390nm~429nm
Electronic Component
LEDDiode / LED
Electronic Component
0.018g
Electronic Component
1
LED
60mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0224625916
Electronic Component
405nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-1608UVC-04 贴片发光二极管(0603)产品概述

一、产品简介

XL-1608UVC-04 是成兴光(Xinglight)推出的一款 0603(1608公制)贴片紫色发光二极管,透镜为无色透明,发光波长峰值 405nm,呈紫色光(近紫外/可见边界)。该器件尺寸小、光通量适中、视角宽(120°),适用于微型指示、装饰照明以及某些近紫外激发或检测场景。封装为正贴(SMD),便于表面贴装工艺自动化生产。

二、主要性能参数

  • 型号:XL-1608UVC-04
  • 封装:0603(1.6 × 0.8 mm 级别 SMD)
  • 发光颜色:紫色(近紫外边,峰值波长 405 nm)
  • 正向电流(工作电流):5 mA(额定)
  • 正向压降(Vf):3.4 V(典型)
  • 发光强度:60 mcd(在额定电流下典型值)
  • 发光角度:120°(半角)
  • 最大功率(封装耗散或推荐限制):100 mW(按产品参数)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 透镜颜色:无色透明透镜
  • 安装方式:正贴(SMD)

三、特点与优势

  • 体积小、重量轻,适合空间受限的应用与高密度装配。
  • 峰值 405 nm 波长,可用于荧光激发、材料检验、指示与视觉效果增强。
  • 宽视角(120°),出光分布均匀,便于做面光或指示用途。
  • 透明透镜能有效输出光强,视觉效果纯净。
  • 工作温度范围宽,适应工业级环境。

四、典型应用场景

  • 指示灯、状态显示和人机界面小型指示器;
  • 紫外荧光激发(如荧光笔、荧光标记检查)和某些光学传感前端;
  • 仪器仪表、便携设备、玩具与装饰照明;
  • 防伪检测、紫外可见混合照明等需近紫外光谱的应用。
    (注:405 nm 为近紫外/可见区,非 UVC,使用时应注意安全防护。)

五、使用与设计建议

  • 驱动与限流:以额定工作电流 5 mA 为设计目标。示例:若供电 5 V,限流电阻 R ≈ (5.0 V − 3.4 V) / 5 mA ≈ 320 Ω,可选 330 Ω。设计时应考虑容差与温升影响。
  • 热设计:虽然功率不大,但长期高温会影响寿命与光输出,建议保证适当的散热路径和PCB铜箔面积。
  • 焊接与工艺:适用 SMT 回流焊工艺。推荐遵循元器件数据手册中提供的回流曲线(通常遵循 JEDEC/IPC 建议,不宜超过封装耐热极限)。
  • 安全提示:405 nm 辐射接近紫外,长期直视或近距离暴露对眼睛和皮肤可能有风险,使用时应避免直视光源并采取必要的防护措施。
  • 防静电与存储:为防止 ESD 损坏,装配与搬运时应采取静电防护;存储环境应干燥,避免受潮影响焊接品质。

六、封装与订购信息

  • 封装形式:0603 SMD,适配常见 0603 PCB 卡尺与贴片机贴装;
  • 品牌:Xinglight(成兴光),型号:XL-1608UVC-04。
    如需批量应用建议向供应商索取完整数据手册以确认回流曲线、绝对最大额定值和尺寸图,并获取样品先行验证在目标系统中的表现。

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