WMSIC Electronic Components

Xinglight XL-5050RGBC

ModelXL-5050RGBC
PackageSMD5050-6P
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-5050RGBC
Type
XINGLIGHT
Minimum package
1000 圆盘

Technical parameters

Power
R:50mW;G:70mW;B:70mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-5050RGBC
Electronic Component
1
Electronic Component
5mm
Package
SMD5050-6P
Electronic Component
R:620nm~630nm;B:460nm~470nm;G:515nm~530nm
Electronic Component
RGB LED
Electronic Component
0.143g
Electronic Component
5mm
Electronic Component
1.6mm
Electronic Component
1
LED
R:300mcd~500mcd;G:900mcd~1450mcd;B:350mcd~450mcd
LED
120°
Electronic Component
BM0226465605

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-5050RGBC 产品概述

XL-5050RGBC 是成兴光(Xinglight)推出的一款 SMD5050 贴片共阳极多色发光二极管,适用于需要高亮度、宽视角与简单色彩混合控制的照明与指示场景。本文基于提供的 R/G/B 通道参数进行说明(若需 C 通道详细参数请提供补充数据)。

一、主要特性

  • 封装:SMD 5050(5.0 mm × 5.0 mm × 1.6 mm)正贴封装,便于自动贴装与回流焊工艺。
  • 配置:共阳极(共阳引脚),便于采用 MCU 下拉驱动或恒流驱动方式实现色彩混合。
  • 发光角度:120°,宽视角适合面光源与背光应用。
  • 抗静电能力(ESD):各色通道典型值 2000 V(人机模型),建议生产与装配时采取防静电保护。

二、电光参数

  • 正向电流(If):R/G/B 标称驱动电流为 20 mA/通道。
  • 正向压降(Vf):R: 1.9–2.3 V;G: 2.8–3.4 V;B: 2.8–3.4 V。
  • 单色功率限制:R: 50 mW;G/B: 70 mW,请在设计时保证功率不过载以延长寿命。
  • 峰值波长(典型):R 625 nm;G 525 nm;B 465 nm。
  • 发光强度(Iv):R 300–500 mcd;G 900–1450 mcd;B 350–450 mcd(按 20 mA 测试条件)。
  • 工作温度:-20 ℃ ~ +85 ℃。

三、封装与机械尺寸

  • 外形尺寸:长 5.0 mm × 宽 5.0 mm,高度 1.6 mm,标准 5050 四脚布局(共阳加三色独立引脚)。
  • 载带方式:卷带(正贴),适配 SMT 贴片机和自动化生产线。

四、驱动与电路设计建议

  • 驱动方式:共阳极接 Vcc(建议与驱动电源相同),各色阴极通过限流电阻或恒流源接地,由 MCU 或驱动器下拉控制。
  • 限流电阻计算示例(以 Vcc = 5 V,If = 20 mA 为例):
    • R 通道:R = (5.0 − 2.1) / 0.02 ≈ 145 Ω(取 150 Ω)
    • G/B 通道:R = (5.0 − 3.1) / 0.02 ≈ 95 Ω(取 100 Ω)
  • PWM 调光:推荐使用 PWM 控制做亮度与色彩混合,PWM 频率建议 ≥ 1 kHz 以避免可见频闪。
  • 热管理:虽单颗功耗不高,但多颗并列或高占空比下需注意 PCB 铜箔散热与合理间距,避免长期高温导致光衰或寿命下降。
  • 功率与可靠性:避免连续在最大功率附近工作,建议做适当降额(例如在高环境温度时降低 If 或占空比)。

五、封装与作业注意事项

  • 焊接:建议采用行业标准回流焊工艺,遵循厂商回流曲线与 JEDEC 建议;避免多次高温循环。
  • 防静电:装配与测试场所须做好 ESD 防护,使用防静电手环、地垫及防静电包装。
  • 储存与搬运:避免潮湿与强光直射,遵循常规 SMD 器件储存管理,必要时使用干燥剂与封盘保存。

六、典型应用

  • 背光与面光源(面板、指示灯、仪表盘)
  • 多色指示与状态显示(消费电子、家电、仪器仪表)
  • 装饰照明与可编程灯带(小型 RGB 灯条、像素点矩阵)
  • 小体积多色信号与提示灯

总结:XL-5050RGBC 以 SMD5050 四合一封装与共阳极连接方式提供稳定的色彩输出、宽视角与便捷的 SMT 生产适配性。设计时请严格按正向电流、功率与热设计要求选用限流或恒流驱动,并做好 ESD 与回流焊工艺控制,以确保长期稳定工作与最佳发光性能。若需完整引脚图、回流曲线或 C 通道(若存在)详细参数,请补充索取。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.