WMSIC Electronic Components

Xinglight XL-ITR9909

ModelXL-ITR9909
PackageThrough-hole-4P, 8.7x4.5mm
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-ITR9909
Type
XINGLIGHT
Minimum package
150 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-ITR9909
Electronic Component
1
Package
Through-hole-4P, 8.7x4.5mm
Electronic Component
940nm
Electronic Component
Reflective Photoelectric Switch
Electronic Component
0.437g
Electronic Component
1
Electronic Component
15us@1mA,1kΩ
Electronic Component
15us@1mA,1kΩ
Electronic Component
BM0259344437
Operating Temperature
20℃~+85℃
Output Type
Photoelectric Transistor
(Vf)
1.2V
Current(If)
50mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-ITR9909 产品概述

一 概述

XL-ITR9909 是成兴光(Xinglight)推出的一款反射式光电开关,采用插件式 DIP-4 封装(尺寸 8.7×4.5mm)。器件由红外发光二极管(LED,λ=940nm)与光电三极管组合而成,输出为光电三极管型,适合用于非接触式反射物体检测与位置感知场合。器件响应速度快、驱动电流范围宽、封装紧凑,便于穿孔安装与电路集成。

二 主要参数

  • 发光二极管正向压降 Vf:1.2V(典型)
  • 发光二极管正向电流 If(最大):50mA
  • 发光二极管反向耐压 Vr:5V
  • 光电三极管集射极击穿电压 Vceo:30V
  • 光电三极管集电极电流 Ic(最大):50mA
  • 波长:940nm(红外)
  • 上升/下降时间:15µs(测试条件:Ic≈1mA,Rload=1kΩ)
  • 工作温度:-20℃~+85℃
  • 封装:插件 DIP-4,8.7×4.5mm

三 主要特点

  • 小巧插件封装,便于手工焊接与波峰/插件式装配;
  • 红外窄谱发射,抗可见光干扰能力好;
  • 响应速度快(典型 15µs),适合中高速脉冲与编码检测;
  • 驱动与输出电流能力足以直接驱动小负载,便于接口设计;
  • 宽工作温度范围,适应一般工业与消费电子环境。

四 引脚与典型接法

典型 DIP-4 引脚(建议在最终设计中以器件实物/数据手册为准):

  • 引脚1:LED 阳极(Anode)
  • 引脚2:LED 阴极(Cathode)
  • 引脚3:光电三极管集电极(Collector)
  • 引脚4:光电三极管发射极(Emitter)

典型驱动与读取电路:使用单电源 VCC(如 5V)驱动 LED,串联限流电阻 RLED=(VCC−Vf)/If。例:VCC=5V, 目标 If=20mA,则 RLED≈(5−1.2)/0.02≈190Ω(取 180–220Ω)。光电三极管可做开集电极输出,外接上拉电阻 Rpull(常用 4.7k–100kΩ,典型 10kΩ),R 值越小响应越快但功耗增加。

五 典型应用

  • 位置与限位检测;
  • 旋转编码器和速度检测(低至中速场合);
  • 纸张、标签、物体存在/缺失检测;
  • 家用电器、打印机、复印机、玩具等设备的非接触传感。

六 使用建议与注意事项

  • 为保证长期可靠性,If 不宜常态超过器件额定值;推荐工作 If 常用 1–20mA,必要时短脉冲驱动可利用更高电流;
  • 光学对准与反射面材质影响检测距离与灵敏度,建议在目标应用环境中标定阈值;
  • 注意环境光(尤其红外干扰)与反射背景,可通过机械遮光、滤光片或软件滤波改善;
  • 焊接时注意温度与时间限制,避免长时间高温损伤封装或内部焊点;
  • 设计时保留测试点与调整余量,调试上拉电阻与 LED 电流以兼顾速度与灵敏度。

七 包装与采购

品牌:Xinglight(成兴光);型号:XL-ITR9909;封装:插件式 DIP-4。采购时建议向供应商索取完整数据手册与样品,确认针脚排列与电气特性以便顺利集成。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.