WMSIC Electronic Components

Xinglight XL-2012UVA

ModelXL-2012UVA
Package805
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-2012UVA
Type
XINGLIGHT
Minimum package
3000 编带

Technical parameters

Power
70mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-2012UVA
Electronic Component
1
Package
805
Electronic Component
390nm~405nm
Electronic Component
LEDDiode / LED
Electronic Component
0.022g
Electronic Component
1
LED
52mcd~78mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0257676176
Electronic Component
405nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-2012UVA 0805 紫色贴片发光二极管(405nm)产品概述

一 产品简介

XL-2012UVA 是成兴光(Xinglight)推出的一款0805封装贴片发光二极管,峰值波长405nm,表现为肉眼可见的紫色/近紫外(Violet/Near‑UVA)。该器件采用无色透明透镜,发光角度宽达120°,适用于指示、激发荧光、材料固化与检测等多种场景。

二 主要参数

  • 发光颜色:紫色(近紫外)
  • 峰值波长:405 nm
  • 正向电流(If):20 mA(典型工作电流)
  • 正向压降(Vf):2.9 V ~ 3.5 V(在If=20 mA时)
  • 最大耗散功率:约70 mW(器件电功率近似值)
  • 透镜颜色:无色透明
  • 发光角度:120°
  • 封装:0805(约2.0 × 1.25 mm)
  • 载带方式:正贴(面光朝外)
  • 工作温度:-40 ℃ ~ +85 ℃

三 特性与优势

  • 近紫外峰值(405 nm),适合用于荧光激发与某些光敏材料的固化;同时比短波UV对材料和人体更温和。
  • 0805小尺寸,适合高密度贴片布局与自动化贴装。
  • 透明透镜与120°宽角发散,提供均匀的大视角照明与指示效果。
  • 封装与载带兼容主流SMT制程,便于产线回流焊接与贴装。

四 典型应用

  • 荧光标记/荧光检测和显影激发光源
  • 紫外或近紫外光固化(小面积、低功率应用)
  • 仪器指示、光学传感与机器视觉照明(特定波段响应)
  • 仪表、医疗传感、安防检测与防伪识别

五 驱动与电路建议

  • 推荐恒流驱动,若用限流电阻:R = (Vsupply − Vf) / If。
    示例(Vs=5V,Vf取典型3.2V,If=20mA):R = (5.0 − 3.2) / 0.02 ≈ 90 Ω,常选100 Ω。
    电阻功耗约 P = I^2·R = 0.02^2×90 ≈ 0.036 W,符合常见1/8~1/4W电阻。
  • 为延长寿命与降低热应力,建议在高温或受限散热条件下降低工作电流(可选 5–15 mA 常用)。短脉冲驱动可实现更高峰值亮度,但需注意平均功率限制。

六 封装、焊接与可靠性

  • 0805尺寸适配标准PCB焊盘与自动贴装;请参照厂家推荐的焊盘尺寸与焊膏量以保证焊点可靠性和光学一致性。
  • 推荐回流焊工艺遵循通用SMT温度曲线,避免超过器件允许的峰值温度;实际回流曲线请参照成兴光提供的详尽资料。
  • 储存与搬运:防静电措施(ESD)必需;密封干燥包装下建议在12个月内使用,开盘后按湿敏等级做相应回流前烘烤处理。
  • 工作环境:在-40 ℃至+85 ℃范围内工作正常;为保证长期可靠性,应避免长时间高温高湿运行并合理散热。

七 选型与注意事项

  • 选型时确认峰值波长与系统光谱响应匹配(405 nm为近紫外/紫光,对部分半导体/荧光染料响应强)。
  • 验证正向压降范围(2.9–3.5 V)与驱动电源及限流设计兼容。
  • 对发光强度一致性、色温与可靠性有严格要求的场合,建议向供应商索取光学与热特性曲线、样品及可靠性报告进行验收。

如需更多电气特性曲线、封装尺寸图或推荐PCB焊盘,请提供采购量与应用场景,我可协助整理更详细的设计资料与应用建议。

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