WMSIC Electronic Components

Xinglight XL-1608SURUBC

ModelXL-1608SURUBC
PackageSMD-4P,1.6x0.8mm
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-1608SURUBC
Type
XINGLIGHT
Minimum package
4000 圆盘

Technical parameters

Power
50mW;70mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-1608SURUBC
Electronic Component
1
Package
SMD-4P,1.6x0.8mm
Electronic Component
465nm~475nm;620nm~630nm
Electronic Component
LEDDiode / LED
Electronic Component
0.02g
Electronic Component
1
LED
150mcd;180mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0228060418
Electronic Component
470nm;630nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-1608SURUBC 0603 SMD 发光二极管 产品概述

一、产品简介

XL-1608SURUBC 是成兴光(Xinglight)推出的一款0603(1608公制)贴片发光二极管,提供红色与蓝色两种发光颜色,采用无色透明透镜设计,发光角度为120°,适配高密度表面贴装应用。体积小、光效稳定、便于自动化贴装,是照明指示、背光与微型显示等场景的理想选择。

二、主要参数

  • 型号:XL-1608SURUBC(0603)
  • 发光颜色:红色、蓝色
  • 峰值波长:红 630nm;蓝 470nm
  • 波长范围:红 620–630nm;蓝 465–475nm
  • 正向电流(IF):20mA(典型驱动)
  • 功率:红约50mW;蓝约70mW
  • 正向压降(Vf):红 1.8–2.6V;蓝 2.8–3.5V
  • 发光强度:红约150mcd;蓝约180mcd(典型)
  • 发光角度:120°
  • 透镜颜色:无色透明
  • 工作温度:-40℃ 至 +85℃
  • 载带方式:正贴(适用于自动贴片设备)

三、电学与光学特性

在推荐的20mA驱动电流下,蓝光和红光分别呈现稳定的峰值波长与典型亮度。正向压降因颜色不同而异,电路设计时应按不同Vf计算限流电阻或恒流源以确保器件在允许功率范围内工作。典型发光角度为120°,适合需要宽照射的指示和背光应用。

四、封装与焊接

0603 标准封装,适配常规0603焊盘布局。建议采用推荐回流曲线进行焊接,温度曲线应满足LED的热容限制以避免光衰或封装损伤。载带包装适用于自动贴片机,便于批量生产与贴装效率提升。

五、典型应用

  • 仪表与指示灯、面板指示
  • 背光源(键盘、按键、微型显示)
  • 消费电子、可穿戴设备微型照明
  • 信号指示与状态反馈

六、使用建议与注意事项

  • 推荐工作电流20mA,必要时通过降低电流来延长寿命或降低亮度。
  • 设计电源时按各色Vf选用限流电阻或恒流驱动,留有裕量避免超过额定功率。
  • 装配过程中注意ESD 防护与湿度管理,避免静电与回流温度冲击。
  • 若用于高温环境或长期高亮度场景,应考虑热管理与降额使用以保证可靠性。

如需详细封装尺寸、回流温度曲线或样品测试数据,可联系成兴光技术支持获取完整资料。

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