WMSIC Electronic Components

Xinglight XL-TD3216UGC

ModelXL-TD3216UGC
Package1206
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-TD3216UGC
Type
XINGLIGHT
Minimum package
2000 编带

Technical parameters

Power
70mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-TD3216UGC
Electronic Component
1
Package
1206
Electronic Component
515nm~530nm
Electronic Component
LEDDiode / LED
Electronic Component
0.042g
Electronic Component
1
LED
6.027cd
LED
30°
LED
Electronic Component
Electronic Component
BM0230032114
Electronic Component
525nm
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-TD3216UGC — 1206 翠绿贴片LED 产品概述

一、产品简介

XL-TD3216UGC 是成兴光(Xinglight)推出的一款高亮度翠绿色(515–530nm,峰值525nm)1206 贴片发光二极管。器件采用无色透明透镜、30°窄发光角设计,适用于需要精确指向性和高显色性的指示与背光应用。标准工作电流为20mA,单颗功率约70mW,正向压降约3.3V。

二、主要参数

  • 发光颜色:翠绿色(515–530nm,峰值525nm)
  • 光强(IV):6027 mcd(测试条件通常为IF=20mA)
  • 视角:30°(典型)
  • 正向压降(Vf):3.3 V(典型)
  • 正向电流(If):20 mA(典型工况)
  • 功率:70 mW
  • 透镜:无色透明
  • 载带方式:正贴(SMD)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:1206(尺寸与PCB贴装脚位兼容)

三、封装与外观

1206(3216公制)封装体积小巧,适合高密度PCB布板。透明透镜利于颜色还原与亮度输出,30°窄角设计使光束集中,利于指示灯、光学对准及小面积照明场合。贴片载带包装便于SMT自动贴装与回流焊生产工艺集成。

四、驱动与电路建议

  • 驱动方式:建议恒流驱动或在每颗LED串联中使用限流电阻以保证稳定工作。
  • 限流电阻计算(示例):以5V供电时,R = (Vcc - Vf) / If = (5.0 - 3.3) / 0.02 ≈ 85 Ω,可选标准值82Ω或100Ω,根据亮度容差调整。
  • 建议不长期超载运行,长期建议按最大额定电流的70%–80%做电流规划以提高寿命与可靠性。
  • 热管理:虽然功率不高,但长时间高电流工作时应考虑PCB铜箔散热与散热通道,避免温度过高导致亮度衰减或寿命下降。
  • 焊接建议:兼容SMT回流焊工艺,需遵循PCBA的标准焊接曲线与制造商对焊接温度峰值的要求以免影响可靠性。

五、典型应用

  • 仪器仪表与面板指示灯
  • 消费电子状态/指示标识
  • 交通指示与小型信号灯
  • 背光与点阵显示(需配合光学设计)
  • 医疗设备与工业控制界面

六、选型与可靠性注意事项

  • 在高温或高湿环境下选型时,应考虑封装耐候性与必要的防护处理(如涂覆或封装)。
  • ESD 保护:LED为敏感器件,制程与装配需做好ESD 管控。
  • 光通量与光色随工作电流和结温变化,实际应用中建议做样件测试以验证视觉效果与光学一致性。
  • 如需更详细的电气特性曲线、光谱分布或封装尺寸图,请联系成兴光相关技术资料获取器件数据手册。

XL-TD3216UGC 以其高光强、窄视角和小型SMD封装,在需要定向翠绿色显示与点光源场合具有良好的性价比与应用灵活性。

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