WMSIC Electronic Components

Xinglight XL-B3528RGBC-BM

ModelXL-B3528RGBC-BM
PackageSMD2835-4P
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-B3528RGBC-BM
Type
XINGLIGHT
Minimum package
2000 圆盘

Technical parameters

Power
G:70mW;B:70mW;R:50mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-B3528RGBC-BM
Electronic Component
1
Electronic Component
2.8mm
Package
SMD2835-4P
Electronic Component
B:460nm~470nm;R:620nm~625nm;G:515nm~530nm
Electronic Component
RGB LED
Electronic Component
0.061g
Electronic Component
3.5mm
Electronic Component
1.9mm
Electronic Component
1
LED
R:350mcd~400mcd;G:1000mcd~1100mcd;B:300mcd~400mcd
LED
120°
Electronic Component
BM0259344836

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-B3528RGBC-BM 3528 七彩白面(Xinglight 成兴光)

一、产品概述

XL-B3528RGBC-BM 为成兴光(Xinglight)出品的SMD贴片发光二极管,封装为 SMD2835-4P(3528 四引脚共阳极)。器件采用无色透明透镜、白面七彩外观设计,适合用于需要高显色性和色彩混合的指示、背光与装饰照明场合。工作温度范围宽,适应性强,便于批量贴装生产。

二、光学与颜色特性

  • 波长范围:B 460–470nm、G 515–530nm(峰值G=520nm)、R 620–625nm(峰值R=620nm)。
  • 发光强度(在 IF=20mA):R 350–400mcd;G 1000–1100mcd;B 300–400mcd。
  • 发光角度:120°,光束分布均匀,适合面光源与指示灯用途。
  • 透镜颜色:无色透明,保证颜色混合纯净,便于实现准确的RGB调色与白光混合。

三、电气与功耗参数

  • 配置:共阳极(Common Anode)。
  • 正向电流(IF):R/G/B 各自典型 20mA。
  • 正向压降(Vf):R 2.0–2.4V;G 3.0–3.4V;B 3.0–3.4V。
  • 功率:R 50mW;G/B 各 70mW。
  • 抗静电能力(ESD):R/G/B 均达 2000V(人体模型),需配合良好防静电措施。

四、机械尺寸与封装

  • 尺寸(典型):长度 3.5mm × 宽度 2.8mm × 高度 1.9mm。
  • 封装形式:SMD2835-4P,适用于回流焊贴装工艺,便于高密度 PCB 布局。
  • 载带方式:正贴(适应自动化贴装)。

五、应用建议

  • 适用于仪表指示、背光模组、按键照明、装饰照明、信号灯及小型显示/标识等需要多色或可调白光的场景。
  • 建议使用恒流驱动或单色限流电阻进行驱动,确保在 IF=20mA 条件下获得标称亮度与色彩。
  • 色彩混合时注意各色电流与亮度匹配,避免偏色;如需高精度白光,建议通过校色与校流电路调整。

六、使用与注意事项

  • 请勿超过额定正向电流与功率,避免因过热导致寿命下降。
  • 贴装与焊接时遵循 SMT 回流工艺规范,避免长时间高温暴露;板级设计应考虑散热与热回流路径。
  • 生产与维修过程中注意 ESD 防护,存储与运输应防潮防尘。

该器件以紧凑的 3528 封装实现优良的色彩表现与可贴装性,适合需要 RGB 混色与高亮度的中小型电子产品。

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