WMSIC Electronic Components

Xinglight XL-502HIRC-850

ModelXL-502HIRC-850
PackageThrough-hole, D=5mm
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-502HIRC-850
Type
D=5MM
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-502HIRC-850
Electronic Component
1
Package
Through-hole, D=5mm
Electronic Component
850nm
Electronic Component
Infrared Emitter
Electronic Component
30°
Electronic Component
0.26g
Electronic Component
1
Electronic Component
BM0259344529
Operating Temperature
25℃~+85℃
Current
35mA
Electronic Component
20mW/sr
(Vf)
1.42V~1.54V
Power Dissipation(Pd)
55mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-502HIRC-850 红外发射二极管产品概述

XL-502HIRC-850是成兴光(Xinglight)推出的一款φ5mm直插式近红外发射二极管,核心波长850nm,专为消费电子、光传感及短距离红外通信场景设计,兼具成本优势与稳定性能,是替代传统红外发射管的高性价比选择。

一、产品核心定位与基础特性

该器件属于标准F5封装(φ5mm圆形直插),聚焦人眼不可见的近红外波段,主要面向对发射效率、温度适应性有基础要求的应用。其核心特性可概括为:

  • 波长精度稳定(典型850nm,与主流红外接收管匹配性好);
  • 辐射强度适中(20mW/sr),满足短距离信号传输;
  • 工业级温度范围,适应-25℃至+85℃的宽环境温度;
  • 直插封装易装配,适合批量生产与原型开发。

二、关键性能参数深度解析

1. 光学与辐射参数

  • 波长:850nm(近红外典型工作波长,避免人眼视觉干扰,同时兼容多数红外接收器件);
  • 辐射强度:20mW/sr(半强度角30°,定向发射能力适中,既避免信号过度扩散衰减,又满足一定角度范围内的接收需求);
  • 视角:30°(半功率角,指辐射强度降至峰值50%时的角度范围,适合需要定向传输的场景,如遥控指向)。

2. 电学性能参数

  • 正向压降(Vf):1.42V~1.54V(典型值约1.48V,不同批次略有波动,需通过串联电阻稳定电流);
  • 额定正向电流(If):35mA(直流连续工作电流上限,实际应用建议留20%余量,控制在20~30mA以延长寿命);
  • 耗散功率(Pd):55mW(最大允许功耗,若电流超过35mA会导致Pd超标,芯片发热损坏);
  • 直流反向耐压(Vr):5V(反向偏置电压上限,禁止施加超过5V的反向电压,否则会击穿)。

3. 环境与可靠性参数

  • 工作温度:-25℃~+85℃(覆盖大部分消费电子与工业入门级场景,如室内家电、户外短距离传感);
  • 存储温度:默认-40℃~+100℃(行业通用范围,保障运输与存储安全)。

三、封装与机械设计

XL-502HIRC-850采用标准φ5mm直插封装,具体结构特点:

  • 外壳为耐高温环氧树脂,透光性稳定,可有效保护内部GaAs基芯片免受物理损伤与环境侵蚀;
  • 引脚间距符合IEC标准(约2.54mm),适配通用PCB板焊接,手工装配也便捷;
  • 引脚材质为镀锡铜,焊接性好,避免虚焊、脱焊问题;
  • 外形小巧(φ5mm×8mm左右,行业常规尺寸),可集成于小型电子设备(如遥控器、智能门锁传感器)。

四、典型应用场景

该器件凭借850nm波长的兼容性与稳定性能,广泛应用于以下领域:

  1. 红外遥控系统:电视、空调、机顶盒等家电的红外发射端(与主流接收管如1838、TSOP38238完美匹配);
  2. 短距离光传感:物体接近检测、距离感应(1~5m范围)、小型光电开关;
  3. 低照度监控补光:小型安防摄像头、车载记录仪的夜间补光(人眼不可见,不干扰环境);
  4. 玩具与小型电子:遥控玩具(如遥控车、无人机)、智能手环的红外通信模块;
  5. 工业入门级传感:流水线物体计数、位置检测(适配低成本传感方案)。

五、使用与选型注意事项

为保障器件寿命与性能稳定,需注意以下要点:

  1. 电流限制:必须串联限流电阻,计算公式为:R=(Vcc - Vf)/If(例:Vcc=5V,Vf=1.48V,If=20mA,则R≈176Ω,选180Ω标准电阻);
  2. 温度控制:避免在密闭高温环境(如>85℃)下长时间满功率运行,可通过散热片或通风改善;
  3. 反向保护:禁止反向接电,若电路可能出现反向电压,需并联1N4148二极管保护;
  4. 焊接规范:焊接温度≤260℃,焊接时间≤3秒,避免热应力损伤芯片;
  5. 光学匹配:若需增加发射距离,可搭配红外透镜(如菲涅尔透镜)聚焦,提升辐射强度。

总结

XL-502HIRC-850作为一款高性价比的5mm直插红外发射管,以稳定的850nm波长、适中的辐射强度与工业级温度范围,覆盖了消费电子、传感与遥控的核心应用场景。其直插封装易装配、成本可控,适合批量生产与原型开发,是替代同类进口器件的理想选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.