WMSIC Electronic Components

Xinglight XL-TD3216PDC

ModelXL-TD3216PDC
Package1206
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
Xinglight XL-TD3216PDC
Type
XINGLIGHT
Minimum package
2000

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-TD3216PDC
Electronic Component
1
Package
1206
Electronic Component
Phototransistor
Electronic Component
0.035g
Current
150nA
Electronic Component
1
Electronic Component
BM0259344226
Electronic Component
880nm
Operating Temperature
40℃~+85℃
Electronic Component
2000
Collector-Emitter Breakdown Voltage(Vceo)
30V
Collector-Emitter and Voltage(VCE(sat))
0.3V@2mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL‑TD3216PDC 产品概述

XL‑TD3216PDC 是成兴光(Xinglight)推出的一款 1206 封装球头红外接收贴片发光二极管(光电晶体管型),针对近红外检测与传感应用进行了结构与参数优化。器件对 880 nm 波长附近的红外辐射响应最佳,具有小体积、易贴装、温度范围宽、低暗电流等特点,适合消费电子、工业控制与安防等场景中短距离或中等灵敏度的光电检测需求。

一、主要性能亮点

  • 峰值响应波长:880 nm(对近红外光敏感,适配常见红外发射源)
  • 集—射极击穿电压 Vceo:30 V(保证在较高偏压下稳定工作)
  • 暗电流:150 nA(低暗电流有助于提高信噪比,减少误触发)
  • 集—射极饱和电压 VCE(sat):0.3 V @ IC≈2 mA(在微安到毫安级探测电流下工作良好)
  • 工作温度:-40 ℃ 至 +85 ℃(适用于广泛环境温度条件)
  • 封装:1206 球头(小型贴片,带球状透镜以扩大接收角与灵敏度)

二、典型应用场景

  • 红外遥控接收(短距家用电器遥控)
  • 光电编码与测速(带有调制红外源的编码检测)
  • 人体/物体接近检测(结合适当光源或遮挡检测)
  • 工业设备位置/限位检测(对 880 nm 光源的响应)
  • 光电通信与短距离链路(需要匹配 880 nm 发射器)

三、电气与光学使用建议

  • 电路接口:常用共射或共集接法。典型连接为集电极通过上拉电阻接至 VCC,发射极接地,集电极作为输出端读取电平。根据使用场景和期望响应速度调整上拉电阻阻值。
  • 上拉电阻选型示例:若期望在明亮条件下 IC≈2 mA,将 VCC 取 5 V,则可近似用 R = (VCC - VCE(sat)) / IC ≈ (5 - 0.3) / 2 mA ≈ 2.35 kΩ。常用范围通常在几百欧至几十千欧,取决于灵敏度与带宽要求。
  • 偏置注意:器件可承受高达 30 V 的集—射极电压,但建议在常规电源范围(如 3.3 V、5 V)内使用以延长稳定性与可靠性。
  • 响应特性:受封装透镜与芯片结构影响,器件对 880 nm 附近波长响应最佳。实际探测电流随入射光强、光斑尺寸与角度变化,设计时应考虑光学耦合效率。

四、机械封装与贴装建议

  • 1206 小封装,有球头透镜,利于增加接收角和灵敏度,适配自动贴片机(SMT)和回流焊工艺。
  • 贴装过程中注意方向性:球头朝向光源方向,确保光轴无遮挡;在 PCB 布局时为其留出直视通道或配套透镜/开窗。
  • 回流焊工艺:建议参照 1206 类 SMD 零件的常规回流曲线与生产规范进行,不在高温或长时间热循环中滥用。若有特殊焊接或清洗要求,请在生产工艺中验证器件性能是否受影响。

五、可靠性与环境适应

  • 宽温工作范围(-40 ℃ 至 +85 ℃)适合户内外多种使用环境,满足多数消费及工业级应用对温度的要求。
  • 低暗电流有利于在低光或夜间环境下维持较高信噪比,但在极低光条件下仍需配合合适的放大与滤波电路以保证判决精度。
  • 器件的长期可靠性依赖于正确的电气偏置、稳健的机械固定以及合规的环境防护(如必要时在光学窗口处加透明封装或密封)。

六、选型与系统集成提醒

  • 与发射端协调:若系统中使用 880 nm 发光二极管或红外 LED,XL‑TD3216PDC 能很好匹配其波长谱响应;若发射波长有所偏移(例如 940 nm),应验证灵敏度是否满足需求。
  • 噪声与增益平衡:在对微弱信号要求较高的应用(如遥感或远距离通信)时,可能需要在接收端增加前级放大、滤波或射频滤波以抑制环境干扰。
  • 大批量采购及测试:建议在样机阶段对暗电流、响应曲线、时域响应等关键参数进行批次测试,确认满足系统性能指标。

总结:XL‑TD3216PDC 以其 1206 小型球头封装、对 880 nm 的响应峰值、低暗电流与宽温适应性,适用于多类近红外探测应用。合理的电路偏置与光学对准可充分发挥该器件在灵敏度与稳定性方面的优势。若需更详细的电气特性曲线、光谱响应曲线或封装尺寸图,请联系厂商索取完整规格书与样片验证。

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