WMSIC Electronic Components

Xinglight XL-TD3216HIRC-850

ModelXL-TD3216HIRC-850
Package1206
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-TD3216HIRC-850
Type
XINGLIGHT
Minimum package
2000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-TD3216HIRC-850
Electronic Component
1
Package
1206
Electronic Component
850nm
Electronic Component
Infrared Emitter
Electronic Component
30°
Electronic Component
0.04g
Electronic Component
45nm
Electronic Component
1
Electronic Component
BM0259344224
Operating Temperature
30℃~+85℃
Current
35mA
Electronic Component
15mW/sr
(Vf)
1.3V~1.5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-TD3216HIRC-850 产品概述

一、产品简介

XL-TD3216HIRC-850 是成兴光(Xinglight)推出的一款 1206 封装球头红外发射二极管,峰值波长约 850nm,具有较窄的发散角和较高的辐射强度,适用于短距到中距红外发射应用。封装小巧、易于贴片加工,适配批量自动化生产。

二、主要性能参数

  • 峰值波长:850nm(典型)
  • 正向压降(Vf):1.3V ~ 1.5V
  • 额定正向电流(If):35mA(最大或典型驱动上限)
  • 耗散功率(Pd):55mW
  • 辐射强度:15mW/sr(典型)
  • 视角(半功率角):30°
  • 半波宽(FWHM):45nm
  • 直流反向耐压(Vr):5V
  • 工作温度范围:-30°C ~ +85°C

三、封装与机械特性

采用 1206 尺寸贴片封装,球头(dome)结构有利于光束集中,便于实现窄角度发射。小体积便于高密度 PCB 布局,兼容常见 SMT 贴装工艺。

四、典型应用场景

适用于红外遥控、夜视/红外照明、接近/距离传感器、红外通信链路、光电开关与编码器、安防摄像补光等场合。较高的辐射强度与小视角使其在需要集中光束的短中距系统中表现优异。

五、使用建议与注意事项

  • 推荐使用限流电阻或恒流驱动,计算示例(5V 驱动、Vf 取1.4V、If 取20mA):R ≈ (5-1.4)/0.02 ≈ 180Ω。
  • 耗散功率 Pd=55mW,Vf×If 在高驱动条件下接近限值,建议在连续工作时优先采用较保守电流或增加间歇工作/脉冲驱动以降低结温。
  • 反向电压仅 5V,避免反向误接或静电击穿;贴片加工与储运应采取 ESD 防护。
  • 按照元器件厂商推荐的回流焊工艺曲线进行焊接,避免过高温度和过长加热时间。

六、可靠性与测试

建议在设计中考虑热阻和结温管理,必要时做寿命加速测试(高温、高湿、循环振动等)以验证在目标应用环境下的可靠性。出厂通常会经过电气和光学参数筛选,如需更严苛的筛选等级可与供应商沟通。

七、样品与订购提示

XL-TD3216HIRC-850 以卷带或盘装形式供应,适合 SMT 自动化贴装。量产前建议索取样品并在目标系统中验证光学角度、辐射强度与热特性。订购时确认包装形式、出货批次和检验要求,以保证一致性。

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