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Xinglight XL-5050YWC
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Xinglight XL-5050YWC
- Type
- XINGLIGHT
- Minimum package
- 1000 卷
Technical parameters
- Power
- 200mW
- Electronic Component
- Electronic Component
- Electronic Component
- XINGLIGHT
- Electronic Component
- XL-5050YWC
- Electronic Component
- 1
- Package
- SMD5050-6P
- Electronic Component
- LEDDiode / LED
- Electronic Component
- 1600K~1800K
- Electronic Component
- 0.157g
- Electronic Component
- 1
- LED
- 120°
- LED
- Electronic Component
- Electronic Component
- BM0259344859
- Operating Temperature
- 25℃~+80℃
- Current
- 60mA
- Type
- 5mmx5mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
Xinglight XL-5050YWC 金黄贴片发光二极管产品概述
一、产品定位与核心价值
XL-5050YWC是Xinglight（成兴光）推出的5050封装金黄贴片LED，定位于中低端照明、指示类场景的基础发光器件。其核心优势在于：稳定的金黄暖光输出、适配SMT自动化生产的正贴载带、宽温范围内的可靠性能，适合批量应用于家电、玩具、小型景观等领域。
二、核心电光学参数详解
该产品关键性能参数明确，可直接匹配驱动电路设计：
- 发光特性：发光颜色为金黄（搭配黄色透镜强化色调一致性），色温区间1600K~1800K（典型暖金黄，接近传统钨丝灯质感），发光角度120°（广域出光，适合氛围照明）；
- 电学参数：正向压降（Vf）2.8V~3.4V（工作电压波动范围，需驱动电路预留0.5V以上余量），额定正向电流（If）60mA（持续发光安全电流，峰值电流需控制在120mA/1ms内），额定功率200mW（对应If=60mA时的功率损耗）；
- 结构特性：独立二极管配置（单颗独立驱动，无串并联依赖），便于灵活设计电路布局。
三、封装与载带方式
- 封装类型：型号中“5050”指向标准5050贴片封装（常规尺寸约5.0×5.0×1.6mm），属于小型化贴片封装，占用PCB空间小，适配高密度电路设计；
- 载带方式：正贴载带（编带方向与贴装方向一致），完全适配SMT贴片机自动化生产，可减少贴装方向错误，提升生产效率。
四、环境适应性与可靠性
工作温度范围为**-25℃~+80℃**，覆盖多数室内及部分低温场景：
- 低温场景：可稳定工作于北方冬季室内、户外小型景观灯（昼夜温差环境）；
- 高温场景：能承受家电电路板、小型设备内部的常规散热温度（避免光衰或器件损坏）。
五、典型应用场景
结合参数特点，该产品适合以下场景：
- 家电/仪器指示灯：电视、空调的电源指示灯（金黄暖光辨识度高，不刺眼）；
- 室内氛围照明：小型LED氛围灯串、桌面装饰灯（120°广角+暖金黄提升温馨感）；
- 玩具/礼品发光：儿童发光积木、节日发光贺卡（低功率安全，无过热风险）；
- 小型景观照明：阳台迷你景观灯、窗台装饰灯（宽温适应昼夜温差）。
六、使用注意事项
为保证性能与寿命，需注意：
- 限流保护：驱动电路需串联限流电阻（公式：R=(Vcc-Vf)/If），如Vcc=5V时，R≈33Ω~40Ω；
- 反向电压控制：LED反向耐压低（一般<5V），需避免反向电压（可并联1N4148等反向二极管保护）；
- 温度管控：工作时避免超过+80℃，高温场景需增加散热片；
- 电流限制：持续正向电流不超过60mA，峰值电流需参考厂商规格（避免脉冲损坏）。
XL-5050YWC作为成兴光的基础型金黄贴片LED，以明确的参数、适配自动化生产的封装，满足中低端发光应用的批量需求，是性价比高的基础发光器件选择。
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