WMSIC Electronic Components

Xinglight XL-C4040UYC

ModelXL-C4040UYC
PackageSMD-4P,4x4mm
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-C4040UYC
Type
XINGLIGHT
Minimum package
500 卷

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-C4040UYC
Electronic Component
1
Package
SMD-4P,4x4mm
Electronic Component
585nm~595nm
Electronic Component
LEDDiode / LED
Electronic Component
0.238g
Electronic Component
1
LED
900mcd
LED
120°
LED
Electronic Component
Electronic Component
BM0259344360
Electronic Component
590nm
Operating Temperature
20℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-C4040UYC — 4.0×3.95mm 侧面黄光贴片 LED 产品概述

一 概述

XL-C4040UYC 为 Xinglight(成兴光)系列 SMD-4P 小型侧面发光贴片发光二极管,方形封装(约 4.0mm × 3.95mm),采用无色透明透镜,单颗独立二极管设计。典型发光为黄光(峰值 590nm),在点亮、指示和侧面发光照明等应用中表现优秀。

二 主要参数

  • 发光颜色:黄色(波长 585nm–595nm,峰值 590nm)
  • 正向电压(Vf):2.0V ~ 2.3V(If = 20mA)
  • 额定正向电流:20mA
  • 功率:50mW
  • 发光强度:900 mcd(典型值,If = 20mA)
  • 发光角度:120°(宽视角侧发光)
  • 二极管配置:独立二极管
  • 透镜:无色透明
  • 封装:SMD-4P(4×4 mm)侧面发光封装
  • 载带方式:侧贴(便于自动化贴装)
  • 工作温度:-20℃ ~ +85℃

三 主要特性

  • 侧面发光设计,适合边缘指示、光槽或面板侧照明,视觉均匀性好。
  • 宽视角(120°),覆盖范围大,便于低高度均匀照明。
  • 小型封装,兼容高速贴片和自动化生产工艺。
  • 透明透镜保证色散小、色温稳定,适合指示与标识灯应用。

四 电气与热设计建议

  • 常用限流电阻计算:R = (Vcc − Vf) / If。例:Vcc = 5V,取 Vf = 2.1V,If = 20mA ⇒ R ≈ 145Ω,常用 150Ω;Vcc = 12V ⇒ R ≈ 495Ω,常用 500Ω。
  • 功率耗散注意:发光功率和芯片自耗会产生热量,PCB 应留足铜箔散热区,避免长时间在高温环境下工作以维持亮度与寿命。
  • 频繁脉冲或高占空时需评估平均电流与结温,保持结温在规格范围内以保证可靠性。

五 典型应用场景

  • 消费电子的指示灯与面板指示(仪表、家电按钮)。
  • 工业设备的状态指示、操控面板背光与光槽引导。
  • 仪表、安防设备和显示边缘照明等需要侧向可见性的场合。

六 封装与贴装建议

  • SMD-4P 小型方形封装,支持自动贴片(侧贴载带)与回流焊工艺。
  • 建议依据厂方推荐的 PCB 贴装孔位与焊盘设计进行布局,保证焊点焊接质量与散热路径。
  • 回流焊温度曲线应符合无铅或有铅焊接规范,避免过高峰值温度或过长保温时间。

七 可靠性与工作环境

  • 适用工作温度范围 -20℃ ~ +85℃,适合大多数室内与轻工业环境。
  • 在高湿、高粉尘或强腐蚀性气氛中使用时建议采取保护措施(密封或涂覆)。
  • 建议在设计阶段考虑冗余与降额使用,以延长使用寿命与提高系统可靠性。

如需更详尽的电气特性曲线、典型光强-电流关系、推荐焊盘尺寸或可靠性测试报告,可向成兴光索取数据手册与工程支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.