WMSIC Electronic Components

Xinglight XL-HD6070UWC-A2

ModelXL-HD6070UWC-A2
PackageSMD,8x7.3mm
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-HD6070UWC-A2
Type
XINGLIGHT
Minimum package
500 袋

Technical parameters

Power
1W
Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-HD6070UWC-A2
Electronic Component
1
Package
SMD,8x7.3mm
Electronic Component
LEDDiode / LED
Electronic Component
6000K~6500K
Electronic Component
0.36g
Electronic Component
1
LED
140°
LED
Electronic Component
Electronic Component
BM0259344543
Operating Temperature
40℃~+85℃
Current
350mA
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-HD6070UWC-A2 1W贴片白光LED产品概述

一、产品核心身份与品牌定位

XL-HD6070UWC-A2是Xinglight(成兴光)推出的1W级中功率贴片白光LED,采用SMD封装(8×7.3mm),延续仿流明6070系列的球头设计,主打宽角度、高可靠性,兼顾亮度与能耗,适用于各类中小功率照明及指示场景。

二、关键性能参数解析

1. 发光与光学特性

  • 发光颜色:标准白色(冷白光范畴),视觉清晰不刺眼;
  • 色温范围:6000K~6500K,亮度偏冷白,适合需要高对比度的场景;
  • 发光角度:140°宽视角,可覆盖较大区域,减少照明死角;
  • 透镜配置:黄色透镜,辅助优化光效一致性,降低光衰影响。

2. 电气与功率参数

  • 额定功率:1W,属于中功率LED(兼顾亮度与续航);
  • 正向电流:350mA(额定工作电流,需匹配恒流驱动);
  • 正向压降:3V~3.4V,不同批次略有差异,选型时需注意驱动电压匹配。

三、封装与结构设计优势

  1. SMD正贴封装:8×7.3mm尺寸紧凑,载带方式为正贴,适合自动化贴装,提升生产效率;
  2. 球头光学设计:仿流明6070球头结构,配合140°宽角,实现均匀发光,避免局部过亮;
  3. 可靠性结构:封装工艺成熟,抗振动、抗冲击,适合工业及消费类产品长期使用。

四、典型应用场景

  1. 室内照明类:橱柜灯、衣柜灯、小夜灯(宽角度覆盖空间,无明显暗区);
  2. 指示与显示类:仪器仪表状态指示灯、小型LED显示屏背光(亮度适中,视觉清晰);
  3. 便携照明类:低功率手电筒、应急灯(1W功率兼顾续航与亮度);
  4. 工业应用类:设备警示灯、小型自动化设备指示灯(宽温适应,可靠性高)。

五、环境适应性与可靠性

  • 工作温度范围:-40℃~+85℃,覆盖低温(如北方户外)及高温(如设备内部)场景;
  • 长期稳定性:SMD封装抗老化,黄色透镜耐磨损,长期使用光衰低(符合成兴光品牌标准)。

六、选型与使用注意事项

  1. 驱动匹配:必须采用恒流驱动(350mA额定电流),避免过流导致光衰或损坏;
  2. 散热设计:1W功率需在PCB上预留散热铜箔或散热片,防止局部过热;
  3. 焊接规范:采用回流焊工艺,焊接温度≤260℃(符合SMD标准),避免手工焊接损伤封装;
  4. 透镜保护:避免尖锐物体刮擦黄色透镜,影响发光均匀性。

该产品以高性价比、宽适应性为核心优势,是中小功率照明及指示场景的优选方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.