WMSIC Electronic Components

Xinglight XL-DA2281SRBC

ModelXL-DA2281SRBC
PackageDIP,15x10mm
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-DA2281SRBC
Type
XINGLIGHT
Minimum package
348 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-DA2281SRBC
Electronic Component
1
Package
DIP,15x10mm
Electronic Component
LED
Electronic Component
1.135g
LED
Electronic Component
Electronic Component
1
LED
20mcd
LED
Electronic Component
Electronic Component
BM0259344711
Operating Temperature
30℃~+70℃
Display Type
7
Electronic Component
2V
Electronic Component
2 positions

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-DA2281SRBC 产品概述

一、产品概述

XL-DA2281SRBC 是成兴光(Xinglight)出品的双位 7 段数码管,单位字符高度 0.28 英寸(约 7.1 mm),发光颜色为红色,采用共阴(共阴极)极性设计。封装形式为 DIP,外形尺寸约 15 × 10 mm,适合通孔安装与手工或波峰焊工艺。该器件适用于各种需要简洁数字显示的电器与电子仪表场合,如简单计数器、小型电表、家电面板及嵌入式指示应用。

二、主要参数

  • 显示位数:2 位(双位 7 段)
  • 字符尺寸:0.28 英寸(约 7.1 mm)
  • 显示类型:7 段(共阴)
  • 发光颜色:红色
  • 发光强度:20 mcd(典型值)
  • 正向压降(Vf):约 2.0 V(典型)
  • 耗散功率(Pd):36 mW(单段)
  • 工作温度范围:-30 ℃ ~ +70 ℃
  • 封装:DIP,外形约 15 × 10 mm
  • 品牌型号:Xinglight XL-DA2281SRBC

三、特性与优势

  • 小尺寸、高集成:0.28 英寸字符高度满足空间受限板面与小型仪表的显示需求。
  • 共阴设计:便于与常见的低侧扫描或共阴驱动芯片配合,适合低成本 MCU 或专用驱动器直接驱动。
  • 稳定亮度:典型 20 mcd 的发光强度在暗/弱光环境中可提供良好可视性。
  • 宽温范围:-30 ℃ 至 +70 ℃ 的工作温度适应多数工业与消费类场景。
  • 兼容通孔工艺:DIP 封装便于手工焊接、试验与小批量生产。

四、应用场景

  • 小型家用电器指示(微波炉、计时器等)
  • 简易计数器、计时器与温控器面板
  • 教学与开发板指示模块
  • 仪表、测试设备的数字指示与状态显示

五、使用与设计建议

  • 驱动电流与限流电阻:依据 Pd 与 Vf,可按推荐工作电流估算。以 Vf = 2.0 V、Pd = 36 mW 推算单段额定电流约 18 mA(I ≈ Pd / Vf)。在常见供电 5 V 下,若以 18 mA 驱动,限流电阻 R ≈ (5 − 2.0) / 0.018 ≈ 167 Ω(推荐取 160–180 Ω);在 3.3 V 系统下 R ≈ (3.3 − 2.0) / 0.018 ≈ 72 Ω(推荐 68–75 Ω)。实际设计时应参照厂方完整数据手册并考虑亮度容差。
  • 多路扫描(多位复用):两位复用时占空比约 1/2,若允许峰值电流上升可在峰值不超过器件极限且平均电流不超标下采取更高峰值电流。例如平均 18 mA、占空比 1/2,则峰值可达约 36 mA(需确认引脚与芯片承受能力)。
  • 接口与驱动:共阴结构适配低侧开关驱动,建议使用晶体管阵列或驱动 IC 做电流开关与电流限制。若直接由 MCU 驱动,注意单引脚电流能力与总板载散热。
  • 焊接与清洗:DIP 封装适合通孔焊接,避免长时间高温加热导致封装或内部连接受损。清洗时避免使用强溶剂直接浸泡,以免影响发光面或标签。
  • 环境与散热:工作环境注意避免长期高温或直射暴晒,安装时留有通风空间以利散热。

六、封装与资料

  • 封装:DIP 通孔,尺寸约 15 × 10 mm(具体引脚排列与机械尺寸请以厂方数据手册为准)。
  • 数据手册建议:在最终设计与量产前,请获取完整 XL-DA2281SRBC 数据手册,以确认引脚排列、最大额定值、典型光学/电气曲线及可靠性测试数据。

如需我帮您根据实际电源电压与驱动方式(静态驱动或复用驱动)计算具体限流电阻、驱动电路示意或引脚参考布局,可提供供电电压与控制方式,我将为您进一步设计与优化。

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