Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Xinglight XL-HDB8080IR-T6A3
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Xinglight XL-HDB8080IR-T6A3
- Type
- XINGLIGHT
- Minimum package
- 1000 卷
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XINGLIGHT
- Electronic Component
- XL-HDB8080IR-T6A3
- Electronic Component
- 1
- Package
- SMD8080-2P
- Electronic Component
- 925nm~955nm
- Electronic Component
- Infrared Emitter
- Electronic Component
- 60°
- Electronic Component
- 0.71g
- Electronic Component
- 40nm
- Electronic Component
- 1
- Electronic Component
- BM0259344534
- Operating Temperature
- 40℃~+85℃
- Current
- 1A
- Electronic Component
- 50mW/sr；160mW/sr
- (Vf)
- 1.3V~1.5V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XL-HDB8080IR-T6A3 产品概述
一、产品简介
XL-HDB8080IR-T6A3 是成兴光（Xinglight）推出的一款高功率贴片红外发射二极管，典型发射波长 940 nm（工作范围 925–955 nm），封装形式为 SMD8080-2P。该器件针对需要高辐射强度与紧凑封装的夜视、监控与感测照明场景设计，单个器件在1A驱动下可提供显著的红外辐射输出。
二、主要电光参数
- 峰值波长：约 940 nm（范围 925–955 nm）
- 光谱半波宽：≈ 40 nm
- 正向压降 Vf：1.3 V ~ 1.5 V（典型 1.4 V）
- 正向电流 If：1 A（典型驱动电流）
- 耗散功率 Pd：2 W
- 辐射强度（辐照度分档）：50 mW/sr；160 mW/sr（按出厂分档）
- 直流反向耐压 Vr：5 V
- 视角（全光束角）：60°
- 工作温度范围：-40 ℃ ~ +85 ℃
三、性能特点
- 高输出：在 1A 驱动条件下，器件可达到较高的辐射强度，适合远距照射与成像补光。
- 窄带红外：940 nm 波段与常见夜视摄像头灵敏峰值匹配，半波宽约 40 nm，能量集中。
- 小型贴片封装：SMD8080-2P 便于高速贴装与密集阵列布置，适合模块化光源设计。
- 宽工作温度：-40 至 +85 ℃ 满足室外与工业级应用要求。
四、典型应用
- 安防监控与夜视照明（CCTV、IP 摄像机红外补光）
- 生物识别/红外成像辅助光源
- 近红外距感与检测（传感器、测距模块）
- 智能家居与人机交互（手势识别、存在检测）
- 工业机器视觉与暗光检视
五、使用建议与注意事项
- 驱动方式：采用恒流驱动优先，以保证输出稳定与延长寿命；如需调光建议使用 PWM 控制，保持合适占空比与散热。
- 热管理：Vf×If 约 1.3–1.5 W 的电功率会转化为热量，应通过铜箔散热、过孔与热垫设计降低结温，避免超过 Pd 2 W 限值。
- 反向保护：反向耐压仅 5 V，电路中需避免反向击穿，可并联二极管或加入限流措施。
- 焊接与装配：兼容标准 SMT 工艺，建议遵循厂家焊接工艺规范，避免反复高温回流与机械应力。
- 防静电：器件对静电敏感，装配与测试时采取 ESD 防护措施。
六、封装与布局建议
- 封装：SMD8080-2P，适合阵列化排布。
- PCB 布局：在焊盘下方及附近布置热通孔并与散热平面相连，保证热量通过 PCB 迅速扩散；尽量为每个发光单元保留隔离区以减少热耦合影响。
- 测试与校准：量产时按辐射强度分档进行筛选，并记录 If、Vf 与温度依赖特性以便后端光学校准。
总结：XL-HDB8080IR-T6A3 以其高辐射强度、紧凑封装与 940 nm 波段特性，适用于各类红外照明与感测应用。合理的恒流驱动与良好的热设计是发挥器件长期稳定性能的关键。若需要进一步的电参数曲线、推荐焊接曲线或封装尺寸图纸，可向成兴光索取完整技术资料。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
