WMSIC Electronic Components

Xinglight XL-DA3461SRBC

ModelXL-DA3461SRBC
PackageDIP,30x14mm
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Xinglight XL-DA3461SRBC
Type
XINGLIGHT
Minimum package
140 卷

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-DA3461SRBC
Electronic Component
1
Package
DIP,30x14mm
Electronic Component
LED
Electronic Component
3.32g
LED
Electronic Component
Electronic Component
1
LED
20mcd
LED
Electronic Component
Electronic Component
BM0259344696
Operating Temperature
30℃~+70℃
Display Type
7
Electronic Component
2V
Electronic Component
4 positions

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-DA3461SRBC 产品概述

XL-DA3461SRBC 是成兴光(Xinglight)推出的一款高可靠性、易驱动的 0.36 英寸红色 4 位 7 段数码管(共阴封装)。封装形式为标准 DIP,外形尺寸 30×14 mm,适合各种面板显示、便携仪表和工业控制终端。该器件以红色发光、良好可视性和稳定的电气特性为主要卖点,适合需要小尺寸数字显示且成本敏感的应用场景。

一、主要特点

  • 4 位、7 段显示设计,字符高度 0.36 英寸,视觉清晰、占板面积小。
  • 发光颜色:红色,单段典型发光强度 20 mcd,显示均匀。
  • LED 极性:共阴(共阴极)结构,便于与常用的低端驱动器或开漏/开集电极输出 MCU 配合。
  • 封装:DIP,外形尺寸 30×14 mm,兼容插装或通孔焊接工艺。
  • 工作温度范围:-30 ℃ ~ +70 ℃,适应一般室温及工业环境。
  • 正向压降(Vf):典型 2.0 V(单段)。
  • 耗散功率 Pd:36 mW(需结合节数和驱动方式评估热耗)。

二、典型应用

  • 手持式或台式测量仪表(温度、湿度、计时器等)
  • 工业控制面板与状态指示
  • 家用小电器显示窗、消费类电子仪表
  • 教学或原型开发平台中的数字显示模块

三、关键规格提示

  • 发光强度:20 mcd(典型值),在同等驱动电流下能保证可读性;环境光强烈时需结合遮光或提高驱动电流优化可视性。
  • 正向压降:约 2.0 V,设计电源与限流电阻时以此为参考值。
  • 耗散功率 36 mW 表示单段或器件在工作时的最大热量吸收能力,长时间工作或高占空比时需注意热管理。
  • 工作温度范围保证了在常见工业和室温条件下的可靠性,但高温环境下发光强度会有所下降,应作温漂评估。

四、电气连接与驱动建议

  • 共阴结构通常将公共针脚接到系统地(GND),各段通过上拉或 MCU 输出驱动(高电平)点亮;若 MCU 引脚无法直接驱动,建议使用限流电阻与驱动管脚配合。
  • 推荐驱动电流范围(参考建议):5~15 mA/段,常用 8~10 mA 可兼顾亮度与寿命。若采用多位动态扫描(4 位),考虑占空比为 1/4,瞬时电流可适当增大但不要超过 LED 最大额定值。
  • 限流电阻示例(以 5 V 电源、目标电流 10 mA、Vf=2.0 V 为例):R = (5.0 − 2.0) / 0.01 = 300 Ω;功率 P = (5.0 − 2.0) × 0.01 = 0.03 W,选用 1/4 W 或更高功率电阻以提升可靠性。
  • 动态扫描时请在驱动器和管脚间加入适当去抖/死区时间,避免交叉导通和可见闪烁。

五、安装与可靠性建议

  • DIP 封装适合通孔焊接,焊接温度和时间应参照通用电子元件工艺控制,避免过热导致外壳或内部应力损伤。
  • 长期高温或持续高电流工作会加速光衰,应适当降额使用并留有散热空间。
  • 在潮湿或腐蚀性环境中,建议增加防护涂层或密封处理以延长使用寿命。

六、兼容性与选型提示

  • 与大多数通用 MCU、LED 驱动器、电平转换器兼容,选型时注意共阴(共阴极)配置是否与系统驱动逻辑匹配。
  • 若项目需要不同颜色或更高亮度,可联系成兴光获取系列替代型号,或选择更大字符尺寸以提升远距离可读性。

XL-DA3461SRBC 以其小巧尺寸、标准 DIP 封装和成熟的电气特性,适合批量安装与快捷替换。设计时建议结合实际应用的亮度、占空比和环境温度做出合理的电流与散热方案,从而在可靠性与可视性之间取得平衡。若需完整电气特性曲线或引脚分布图,请参照厂商详细数据手册或联系成兴光技术支持。

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