WMSIC Electronic Components

Xinglight XL-ITR9608

ModelXL-ITR9608
PackageThrough-hole-4P, 13x6mm
BrandXINGLIGHT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
Xinglight XL-ITR9608
Type
XINGLIGHT
Minimum package
150 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINGLIGHT
Electronic Component
XL-ITR9608
Electronic Component
1
Package
Through-hole-4P, 13x6mm
Electronic Component
5mm
Electronic Component
Photoelectric Switch(Phototransistor Output)
Electronic Component
0.677g
Current
1nA@Vce=20V
Electronic Component
1
Electronic Component
BM0259344750
Load Voltage
35V
Load Current
20mA
Electronic Component
Electronic Component
Electronic Component
150

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL-ITR9608 产品概述

XL-ITR9608 是成兴光(Xinglight)推出的一款对射式光电开关(Photointerrupter),采用插件式 DIP-4P 封装,尺寸约 13 × 6 mm。器件由一颗 940 nm 红外发光二极管(发射端)和一个光电三极管(接收端)面对面构成,适用于印刷、纸张检测、位置与行程检测、编码器与各类物体穿透/遮挡检测等工业与消费电子应用。

一、主要参数一览

  • 波长(发射):940 nm(红外,不可见)
  • 输出类型:光电三极管(集电极-发射极输出)
  • 正向压降 Vf(LED):1.2 V
  • 正向电流 If(最大):50 mA
  • 集电极电流 Ic(最大):20 mA
  • 集射极击穿电压 Vceo:35 V
  • 直流反向耐压 Vr(LED):5 V
  • 上升/下降时间:15 μs @ 1 mA, 1 kΩ
  • 工作温度范围:-20 ℃ ~ +85 ℃
  • 封装:插件 DIP-4P,外形尺寸约 13 × 6 mm
  • 型号/品牌:XL-ITR9608 / Xinglight(成兴光)

二、结构与工作原理

XL-ITR9608 为对射式(through-beam)结构:发光二极管与光电三极管相对安装,形成一条光路。当物体穿过两极之间的缝隙时,会阻断红外光,接收端电流变化,经过简单电路即可判别遮挡状态。光电三极管输出为电流型,常与上拉电阻或电压比较器/MCU 输入配合使用,方便实现开关量信号。

三、典型电气设计要点

  • LED 驱动:根据 Vf = 1.2 V,若系统电源 VCC=5 V,期望 If=20 mA,限流电阻 R ≈ (VCC - Vf) / If = (5 - 1.2) / 0.02 ≈ 190 Ω(可选标准值 180 Ω 或 220 Ω)。选择 If 时应兼顾发光强度、响应速度与器件寿命,避免长期满载 50 mA。
  • 接收端上拉:光电三极管通常配置上拉电阻到 VCC(10 kΩ 常用,若需要更快响应可降低到 1 kΩ 左右,但会增加功耗)。响应时间受光电流和负载电阻影响——规格给出的 15 μs 是在 Ic ≈ 1 mA 且 1 kΩ 条件下测得,实际应用中大电流/大负载会影响时序。
  • 极性与引脚:DIP-4P 常为 LED (Anode, Cathode) 与 三极管 (Collector, Emitter) 四脚排列,接线时请以样品引脚图或厂方 Datasheet 为准。

四、应用场景与优势

  • 应用:纸张计数/缺纸检测、机械限位、编码器、装配线件存在检测、打印机/复印机走纸检测、光栅/遮断式传感等。
  • 优势:对射式结构抗背景光能力强、响应稳健;940 nm 红外光穿透与反射率稳定,适配多数黑/白或非反光材料;小巧插件封装便于通过孔板安装与维修更换;工作温度宽,适配常见工业环境。

五、选型与使用注意

  • 电流控制:避免长期在最大 If(50 mA)条件下工作,推荐在保证可靠检测的最低发光电流下使用以延长寿命并降低发热。
  • 速度权衡:若需更快的响应,应减小上拉电阻并在允许范围内提高接收端电流,但要注意会增加功耗并可能缩短器件寿命。
  • 环境与安装:对射式要求发射与接收端对准,安装时防止异物遮挡对准面;940 nm 为不可见光,调试时可使用示波器或临时红外指示工具定位。
  • ESD 与机械应力:在安装与维修过程中注意防静电保护(尤其是 LED 端),避免强烈机械冲击或弯折引脚。

六、小结

XL-ITR9608 是一款性能均衡的对射式光电开关,940 nm 发射、光电三极管输出和 DIP 插件式封装使其在各种穿透/遮挡检测场景中表现稳定可靠。凭借简单的驱动与读取电路,它适合快速集成到中低速、常温工业与消费类设备中。在选型与电路设计时,应关注发光二极管的限流与接收端上拉电阻对响应速度与功耗的影响,以达到最佳的灵敏度和寿命平衡。若需更详细的引脚定义、典型电路或光学曲线,请参考厂方完整 Datasheet 或联系供应商获取物料与技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.