WMSIC Electronic Components

Silergy SY8088IAAC

ModelSY8088IAAC
PackageSOT-23-5
BrandSILERGY
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
silergy SY8088IAAC
Type
SILERGY
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SILERGY
Electronic Component
SY8088IAAC
Electronic Component
1
Package
SOT-23-5
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.048g
Electronic Component
1
Features
Output
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0000284588
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
2.5V~5.5V
Switching Frequency
1.5MHz

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:SY8088IAAC 电源管理集成电路

1. 引言

SY8088IAAC 是由矽力杰(Silergy Corp.)推出的一款高性能电源管理集成电路(IC),采用 SOT23-5 封装。这款器件专为对功耗敏感的应用场景设计,适合用于便携式设备、消费电子、智能家居以及其他广泛的电子产品中。SY8088IAAC 以其高效的电源管理能力和优异的集成特性,为现代电子设计提供了理想的解决方案。

2. 主要特性

  • 高效率:SY8088IAAC 采用先进的电源管理架构,可以实现极高的电源转换效率,通常超过 90%。这对于延长电池使用时间和降低热量生成是至关重要的。

  • 宽工作电压范围:该IC支持较宽的输入电压范围,通常在 2.5V 至 6V 之间,适应更多的应用场景和设备。

  • 消费电流低:SY8088IAAC 具有极低的待机功耗,令其在低功耗设计中表现突出,使得电池供电的设备更为耐用。

  • 集成度高:内置多项功能减少了外部组件的需要,简化了系统设计,并降低整体 BOM(材料清单)成本。

  • 过压/欠压保护:内置保护机制确保设备在电源异常情况下的安全运行,提升系统的可靠性。

3. 封装与尺寸

SY8088IAAC 采用 SOT23-5 封装,尺寸小巧,适合在空间有限的PCB(印刷电路板)设计中使用。此超小型封装使得 SY8088IAAC 既可以用于低体积设备又不妨碍散热性能。

4. 应用领域

SY8088IAAC 广泛应用于各种电子设备中,如:

  • 移动设备:如智能手机、平板电脑等。
  • 智能家居设备:包括智能灯、传感器和智能控制中心。
  • 可穿戴设备:如智能手表和健身追踪器。
  • 消费电子产品:如数字相框、便携式播放器等。
  • 工业设备:用于各种嵌入式系统和工业控制应用。

5. 性能参数

以下是 SY8088IAAC 的一些核心性能参数:

  • 输入电压范围:2.5V – 6V
  • 输出电压:可调,便于满足不同设备的需求
  • 输出电流:最大支持 300mA
  • 开关频率:通常在 300kHz 左右,可以在一定范围内进行调整
  • 工作温度范围:-40°C 至 +85°C,确保在极端环境下运行可靠

6. 设计注意事项

在使用 SY8088IAAC 进行设计时,需特别注意 PCB 布局以降低电源噪声,增加散热面积,以保证整体系统的稳定性。此外,选择适当的输入和输出电容器,能进一步提升稳压效果与瞬态响应。

7. 结论

SY8088IAAC 是一款兼具高效能与高集成度的电源管理 IC,适合各类电子产品的广泛应用。其小巧的 SOT23-5 封装使其在空间受限的应用中尤为理想。凭借强大的功能和可靠的性能,SY8088IAAC 在现代电子设计中无疑是一款极具价值的选择,为用户提供优异的电源管理解决方案。未来,随着对高性能电源解决方案需求的不断增长,SY8088IAAC 将持续为各类应用提供支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.