WMSIC Electronic Components

XUNPU SMN-303

ModelSMN-303
PackageSMD
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU SMN-303
Type
XUNPU
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
SMN-303
Electronic Component
1
Package
SMD
Electronic Component
SIM Connector
Electronic Component
0.666g
Type
Nano SIM
Electronic Component
1
Electronic Component
BM0084335390
Operating Temperature
25℃~+85℃
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Connector Type
Card Socket
Electronic Component
Electronic Component
Electronic Component
1500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMN-303 产品概述

一、产品简介

SMN-303是一款高性能的自弹式NanoSIM卡连接器,专为SMD(表面贴装)应用设计。该连接器由知名品牌XUNPU(讯普)制造,具备一流的品质保证和稳定的性能。其设计目标是为智能手机、平板电脑、物联网设备及其他便携式电子产品提供可靠的SIM卡连接解决方案,满足现代电子产品对空间和性能的双重需求。

二、产品特点

  1. 自弹式设计:SMN-303采用自弹式设计,使得SIM卡在插入后能自动弹出,极大地提升了用户的操作便捷性。这一设计方便用户在需要更换SIM卡时,能够快速且流畅地完成操作,避免了传统卡座需手动拔出的不便。

  2. NanoSIM卡兼容性:该连接器专为NanoSIM卡设计,符合当前主流智能设备的标准。NanoSIM是目前最小的SIM卡标准,具有体积小、重量轻的优势,适合现代极薄设备的需求。

  3. SMD封装:作为一种表面贴装设备,SMN-303能够方便地与PCB(印刷电路板)直接焊接,进一步减少了系统的整体尺寸,同时提高了生产效率。在快速生产和安装过程中,SMD技术也降低了制造成本。

  4. 结构坚固:SMN-303采用优质的材料和精密的制造工艺,确保了连接器的耐用性和长期的可靠性。其设计经过严苛的测试,确保在各种环境下的稳定运行,包括高温、低温和潮湿条件下。

  5. 卓越的电气性能:SMN-303的电气连接性能优越,具有低插入损耗和优良的接触电阻。这种电气特性确保了数据传输的高速和稳定,使得设备在运行时能够高效地处理各种网络通信任务。

三、应用场景

SMN-303适用于广泛的应用场景,包括但不限于:

  • 智能手机:作为现代手机中不可或缺的组成部分,SMN-303能够为用户提供便捷而高效的网络连接。
  • 平板电脑:随着平板电脑的普及,越来越多的型号支持SIM卡连接,SMN-303凭借其小型化设计,成为理想的解决方案。
  • 物联网设备:在物联网迅速发展的今天,各种智能设备都需要稳定的网络连接,SMN-303能够满足这些多样化的应用需求。
  • 车载设备:随着车载智能系统的普及,SMN-303可以为车载导航、娱乐和通信系统提供良好的SIM卡接口。

四、技术规格

  • 封装类型:SMD
  • 卡类型:NanoSIM
  • 高度:1.37mm
  • 连接方式:表面贴装
  • 材料:高强度塑料和导电金属
  • 工作温度范围:-40°C至+85°C

五、市场前景

考虑到NanoSIM卡在智能设备中的广泛应用以及物联网时代的到来,SMN-303的市场前景广阔。随着用户对设备连接性要求的增加,能够提供高效、可靠连接解决方案的元器件将会越来越受欢迎。XUNPU作为行业内的领先品牌,具备较强的研发能力和市场响应速度,有望在连接器领域持续占据市场的领先地位。

六、总结

SMN-303自弹式NanoSIM卡连接器不仅具备高度的兼容性和便捷性,同时也以其优越的电气性能和坚固的结构满足了现代电子产品对连接质量的要求。凭借其出色的设计和强大的应用灵活性,SMN-303无疑是电子设备制造商在选择SIM卡连接解决方案时的理想选择。无论是在智能手机、平板电脑还是物联网设备中,SMN-303都展现了其卓越的价值和广泛的适用性。

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