Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XUNPU TF-115-BCP9
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XUNPU TF-115-BCP9
- Type
- XUNPU
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XUNPU
- Electronic Component
- TF-115-BCP9
- Electronic Component
- 1
- Package
- SMD
- Electronic Component
- SD / Connector
- Electronic Component
- 0.952g
- Type
- Micro SD
- Electronic Component
- 1
- Electronic Component
- BM0230875203
- Operating Temperature
- 25℃~+85℃
- Electronic Component
- Electronic Component
- Connector Type
- Card Socket
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
- Electronic Component
- 1.8mm
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TF-115-BCP9 产品概述
TF-115-BCP9 是讯普（XUNPU）推出的一款低高度、自弹式 MicroSD（TF）卡座，采用贴片（SMD）封装，面向对厚度和可靠性有严格要求的便携式与嵌入式设备。其最大本体高度仅 1.8mm，适用于超薄终端设计，同时支持自弹式卡片插拔，便于用户操作与维护。
一、主要特点
- 自弹式（push-push）卡连接方式，插入即锁、再次按压即弹出，操作简便且无需额外机构。
- 兼容 MicroSD/TF 卡标准，适配广泛的存储卡产品。
- 本体最大高度 1.8mm，适合对厚度敏感的移动设备、IoT 模块、车载系统等应用。
- 贴片（SMD）封装，支持表面贴装工艺，利于自动化生产与高效组装。
- 工作温度范围 -25℃ 至 +85℃，满足多数工业级与民用环境要求。
- 品牌保障：讯普（XUNPU）出品，品质控制与供应链稳定。
二、技术规格（概要）
- 型号：TF-115-BCP9
- 卡类型：MicroSD（TF）卡
- 连接方式：自弹式
- 连接器类型：卡座
- 本体最大高度：1.8mm
- 封装形式：SMD（表面贴装）
- 工作温度：-25℃ ~ +85℃
（注：如需完整机械图、PCB 布局建议和接脚定义，请联系供应商获取详细资料与 2D/3D 文件。）
三、典型应用场景
- 智能手机与平板的外接存储扩展（超薄参考设计）
- 行车记录仪、车载多媒体与导航设备
- 智能家居网关、监控摄像头与边缘计算终端
- 工业控制终端、数据采集仪器及嵌入式开发板
- 穿戴设备、便携式数码产品及其他空间受限设备
四、安装与使用建议
- 推荐按生产商提供的 PCB 布局和焊盘设计进行贴片安装，保证焊点强度与可靠的电气连接。
- 支持常规无铅回流焊流程，建议遵循元件制造商或锡膏供应商的回流曲线参数以降低应力损伤。
- 插拔操作应沿卡槽正方向进行，避免侧向或斜向用力，以延长卡座寿命并保护卡片金属接触点。
- 在极端温湿环境使用时，建议配合设备密封设计防止水汽或灰尘进入卡座腔体。
五、储存与运输
- 请在干燥、无腐蚀性的环境中存放，避免长期暴露于高温、高湿或盐雾环境。
- 建议使用原厂防静电托盘或卷带包装保存与运输，防止机械损伤与静电积累。
六、质量与支持
讯普（XUNPU）提供产品一致性与可靠性的质量管理支持，常规可提供样品测试、批量供货以及相关合规与检验报告。对于特殊应用（如更宽温度范围或特殊表面处理要求），可与供应商沟通定制需求与技术验证。
如需 TF-115-BCP9 的详细 2D/3D 尺寸图、PCB 推荐焊盘、材料与电气接脚定义或样品报价，请提供项目要求或直接联系讯普技术支持获取完整技术文档。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
