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XUNPU WAFER-GH1.25-4PLB
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XUNPU WAFER-GH1.25-4PLB
- Type
- XUNPU
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XUNPU
- Electronic Component
- WAFER-GH1.25-4PLB
- Electronic Component
- 1
- Package
- SMD,P=1.25mm
- Electronic Component
- 1
- Electronic Component
- Wire-to-Board
- Electronic Component
- 0.44g
- Electronic Component
- 1.25mm
- Electronic Component
- Electronic Component
- PIN
- 4P
- Electronic Component
- 1
- Electronic Component
- GH
- Electronic Component
- BM0263429951
- Electronic Component
- LCP
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
WAFER-GH1.25-4PLB 产品概述
一、产品简介
WAFER-GH1.25-4PLB 是 XUNPU（讯普）旗下 GH 系列的线对板立贴型针座，1x4P 排针，间距 1.25mm，适用于空间受限且需垂直连接的电子设备内部连接。外观为米色，塑料材质为 LCP，整体设计兼顾强度与可焊性，适配常规回流焊工艺。
二、主要电气与材料参数
- 顶级参数：额定电流 1A，额定电压 125V。
- 触头材料：黄铜基体，表面镀锡，保证良好导电性与焊接性。
- 工作温度范围：-25℃ ~ +85℃，满足一般消费类和工业级温度要求。
- 排针形式：1 排，4 PIN；排距 P = 1.25mm，立贴（垂直）安装方式。
三、机械尺寸与封装信息
- 尺寸参考：Z 轴（板上高度）= 4.2mm；X 轴板上底边长度（间距线）= 8.25mm；Y 轴板上底边宽度 = 4.95mm。
- 封装方式：SMD（Surface Mount Device），便于贴片机组装与自动化焊接。
- 附加特征：辅助焊脚（辅助焊点）用于增强焊接强度与定位稳定性，利于振动和机械应力下的可靠性。
四、工艺与安装建议
- 焊接：表面镀锡触点和 LCP 塑料适配标准无铅回流焊工艺，建议根据 PCB 材料和元件密度优化回流曲线以保护插针与塑料件。
- PCB 设计：参考板上尺寸（X=8.25mm，Y=4.95mm）进行焊盘布局，辅助焊脚应有足够的焊盘面积以形成可靠焊点并降低热应力集中。
- 放置与贴装：SMD 立贴结构可用标准贴装设备吸取，但在吸嘴选择与放置压力上应注意保护针体垂直性与外观。
五、适用场景
适用于小型家用电器、消费类电子、通信模组、LED 驱动与显示模组、物联网终端等需要板对线、线对板的连接场合，尤其在空间受限、对插拔频率要求不高但要求稳固焊接的内部连接结构中表现优异。
六、可靠性与注意事项
- 机械可靠性：辅助焊脚有助于提升抗剪切与振动能力，但仍建议在设计时考虑应力分布，避免直接作为受力点。
- 环境适应：工作温度范围适合一般环境，若用于更高温或更严苛环境（如车规或高温工况），需做专项验证。
- 防护与清洁：回流后建议按工艺要求清洗，避免长时间暴露在腐蚀性气体中影响镀层寿命。
七、选型与采购建议
产品型号：WAFER-GH1.25-4PLB，参考系列 GH，封装 SMD，间距 1.25mm，1x4P。选型时确认所需电气规格（电流/电压）、板上高度与空间布局、以及是否需要辅助焊脚以提升可靠性。采购可向 XUNPU（讯普）授权经销商获取样品与工程支持。
如需进一步的 2D/3D 尺寸图、PCB 推荐焊盘样式或回流焊曲线建议，可提供具体应用板栈与组装工艺以便给出更精确的设计支持。
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