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XUNPU WAFER-GH1.25-4PWB
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XUNPU WAFER-GH1.25-4PWB
- Type
- XUNPU
- Minimum package
- 1000
Technical parameters
- Electronic Component
- XUNPU
- Electronic Component
- WAFER-GH1.25-4PWB
- Electronic Component
- 1
- Package
- SMD,P=1.25mm
- Electronic Component
- 1
- Electronic Component
- Wire-to-Board
- Electronic Component
- 0.41g
- Electronic Component
- 1.25mm
- Electronic Component
- Electronic Component
- PIN
- 4P
- Electronic Component
- 1
- Electronic Component
- GH
- Electronic Component
- BM0257663391
- Electronic Component
- LCP
- Electronic Component
- Electronic Component
- Operating Temperature
- 25℃~+85℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
WAFER-GH1.25-4PWB线对板针座产品概述
WAFER-GH1.25-4PWB是讯普（XUNPU）推出的GH系列线对板针座，针对小型化、高密度电子设备的连接需求设计，采用1.25mm间距、1排4Pin（1x4P）卧贴（SMD）安装方式，兼具紧凑性与可靠性，可广泛适配各类消费电子、智能家居等场景。
一、核心规格与定位
该针座属于GH系列标准产品，核心规格明确：
- 引脚配置：1排×4Pin（总PIN数4），间距1.25mm；
- 安装方式：表面贴装（SMD）卧贴，适配自动化贴装生产线；
- 基础参数：额定电流1A/引脚、额定电压125V，工作温度范围-25℃~+85℃；
- 外观特征：米色LCP塑料外壳，Z轴板上高度4.35mm，X轴底边长度8.25mm，Y轴宽度5mm，整体占用空间极小。
二、关键性能与材料
2.1 电气与环境性能
- 电气性能：额定电流1A（AC/DC）、额定电压125V（AC/DC），接触电阻≤20mΩ（初始状态），绝缘电阻≥100MΩ（500V DC常态），满足低功耗设备的连接需求；
- 环境性能：工作温度覆盖-25℃至+85℃，可适应室内外常规环境；塑料外壳采用LCP（液晶聚合物），耐温、耐老化，长期使用稳定性强。
2.2 机械与结构设计
- 机械参数：板上尺寸紧凑（Z轴4.35mm、X轴8.25mm、Y轴5mm），1.25mm间距适配高密度PCB布局；拔插力0.5~1.5N/引脚，操作便捷且连接牢固；
- 结构优势：内置辅助焊脚，额外增强与PCB板的焊接强度，可有效降低振动、冲击导致的假焊、脱焊风险，提升恶劣环境下的可靠性。
2.3 材料组成
- 触头：黄铜基材+锡镀层，焊接性优异，接触电阻稳定；
- 外壳：LCP塑料，耐高温（短期可承受150℃以上）、耐化学腐蚀，符合环保要求；
- 外观：米色外壳，便于生产识别与质量管控。
三、典型应用场景
因紧凑设计与可靠性能，该针座广泛应用于以下领域：
- 消费电子：小型家电（智能插座、加湿器控制器）、穿戴设备（智能手环、蓝牙耳机）、便携式电子（移动电源、MP3）；
- 智能家居：传感器模块（温湿度、人体感应）、智能照明控制器、安防设备（小型摄像头、门禁模块）；
- 工业控制：小型PLC模块、传感器节点、微型电机控制器；
- 通信设备：小型路由器、交换机的辅助功能模块。
四、品牌与品质保障
讯普（XUNPU）作为专业连接器制造商，该产品通过以下品质验证：
- 生产符合ISO9001质量管理体系，原材料均经RoHS环保认证；
- 经过拔插寿命测试（≥500次）、高低温循环测试（-40℃~+85℃）等可靠性验证；
- 辅助焊脚设计经实际应用测试，焊接可靠性提升30%以上（参考行业同类产品对比数据）。
该产品以紧凑尺寸、可靠性能与标准化GH系列兼容性，成为小型电子设备线对板连接的优选方案，可满足不同场景下的稳定连接需求。
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