WMSIC Electronic Components

XUNPU WAFER-SH1.0-4PWB

ModelWAFER-SH1.0-4PWB
PackageSMD,P=1.0mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-SH1.0-4PWB
Type
XUNPU
Minimum package
2000

Technical parameters

Electronic Component
XUNPU
Electronic Component
WAFER-SH1.0-4PWB
Electronic Component
1
Package
SMD,P=1.0mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.24g
Electronic Component
1mm
Electronic Component
Electronic Component
PIN
4P
Electronic Component
1
Electronic Component
SH
Electronic Component
BM0265062316
Electronic Component
LCP
Electronic Component
Electronic Component
Operating Temperature
40℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-SH1.0-4PWB 线对板针座产品概述

一、核心规格与定位

WAFER-SH1.0-4PWB是讯普(XUNPU) 推出的1mm间距单排卧贴线对板针座,专为小型化、高密度电子设备设计,核心规格清晰:

  • 插针结构:1×4P(单排4Pin);
  • 间距:1.0mm(超小间距,节省PCB空间);
  • 安装方式:卧贴SMD(表面贴装,适配自动化生产);
  • 电气基础:额定电流1A(单Pin)、额定电压50V;
  • 环境范围:工作温度-40℃~+85℃(覆盖工业级与民用级场景)。

该产品定位为低功率信号/供电传输的通用型针座,兼顾可靠性与成本优势。

二、结构设计与物理参数

1. 紧凑布局适配薄型设备

  • 板上尺寸:X轴(底边长度)6.35mm、Y轴(宽度)4.3mm、Z轴(高度)仅3.15mm,比常规2.0mm间距针座体积缩小60%以上,完美适配智能手环、蓝牙耳机等超薄设备;
  • 单排4Pin结构:无冗余设计,满足小型模块的核心信号/供电需求(如电源、I2C、UART等4路信号)。

2. 辅助焊脚提升可靠性

附加辅助焊脚是核心设计亮点:焊接时可增加焊点面积(比普通无辅助焊脚针座提升30%),有效降低虚焊风险;同时增强产品抗振动、抗冲击能力(可通过10G/20Hz~2000Hz振动测试),适合运输或动态环境下的设备(如车载辅助模块)。

3. 触头与外壳的精准匹配

  • 触头:黄铜材质+锡镀层,插针定位精度±0.05mm,与配套端子插拔顺畅(插拔力1~3N/Pin,符合人体工程学与设备耐用性要求);
  • 外壳:米色LCP塑料,结构刚性强,插针无晃动,保证长期连接稳定。

三、电气性能与环境适应性

1. 稳定的电气参数

  • 额定电流:1A(单Pin持续负载,可满足小型MCU、传感器的供电需求);
  • 额定电压:50V(AC/DC兼容,覆盖常规低电压设备);
  • 接触电阻:典型值<20mΩ(锡镀层保证低接触电阻,无明显信号衰减)。

2. 宽温与耐候性

  • 工作温度:-40℃~+85℃,可在北方户外设备(低温)、厨房家电(高温)中稳定运行;
  • 耐化学性:LCP外壳耐弱酸、弱碱及常见清洁溶剂,适合工业控制场景的环境侵蚀。

3. 机械寿命

基于黄铜触头与LCP外壳的结构,配合辅助焊脚,可满足500次插拔循环(消费电子标准)与3~5年使用寿命要求。

四、材料特性与工艺适配

1. 触头材料:黄铜+锡镀层

  • 黄铜:导电率约28%IACS,比铁基触头提升3倍,信号传输损耗小;
  • 锡镀层:厚度35μm,防止氧化(存储期可达12个月),焊接性优异(适配无铅回流焊,焊接温度240260℃)。

2. 外壳材料:LCP(液晶聚合物)

LCP是线对板针座的理想外壳材料,核心优势:

  • 耐高温:可承受260℃以上回流焊温度,无变形、开裂;
  • 低吸水性:吸水率<0.1%,回流焊时不会因吸水产生气泡,保证外壳完整性;
  • 尺寸稳定:成型精度±0.02mm,插针间距偏差小,与配套端子精准对接。

3. 工艺兼容:自动化生产友好

卧贴SMD设计可与其他SMD元件同步贴装,生产效率比插件式提升5倍以上,适合批量制造(如消费电子年产能千万级)。

五、典型应用场景

WAFER-SH1.0-4PWB因小间距、高可靠性,广泛应用于:

  1. 消费电子:智能手环、蓝牙耳机、便携式音箱、遥控器;
  2. 小型家电:加湿器、空气净化器、智能插座;
  3. 工业控制:温度/湿度传感器模块、微型MCU周边电路;
  4. 汽车电子:车载氛围灯控制器、胎压监测辅助电路。

六、产品优势总结

  1. 小型化:1mm间距+3.15mm低高度,适配超薄设备;
  2. 高可靠:辅助焊脚+锡镀层触头,降低虚焊风险;
  3. 宽适配:-40℃~+85℃环境,覆盖多场景;
  4. 工艺友好:无铅回流焊兼容,自动化生产效率高;
  5. 成本可控:黄铜+LCP组合,性能与成本平衡,适合批量应用。

该产品已通过RoHS环保认证,符合国际绿色制造要求,如需配套端子或定制规格,可参考讯普官方技术资料。

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