Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
WAFER-PH2.0-4PWB是讯普(XUNPU) 推出的线对板针座连接器,属于PH系列2.0mm间距衍生型号,采用1x4P单排卧贴(SMD) 封装设计。其核心定位是兼顾可靠性、轻薄化与经济性,专为中小功率电子设备的内部信号/电源传输打造,是替代传统直插针座、提升产品空间利用率的理想选择。
该产品参数围绕“小间距、高可靠、贴装友好”设计,关键参数及实际价值如下:
类别 参数详情 实际意义 电气参数 额定电流2A、额定电压250V、-25℃~+85℃ 满足中小功率设备(如家电、传感器)的传输需求 机械参数 1x4P单排、间距2mm、Z轴高度5.6mm 紧凑尺寸适配薄型设备,PH标准间距兼容性强 材料参数 黄铜镀锡触头、LCP塑料外壳、辅助焊脚 黄铜导电优+锡耐氧化,LCP耐回流焊温度区别于普通针座,该产品在两侧增加辅助焊脚:贴装时可与PCB额外焊接,抗剥离强度比无辅助焊脚型号提升约30%,避免因插拔端子、设备振动导致脱落,尤其适合频繁插拔场景。
采用SMD贴装工艺,无需PCB钻孔,可通过回流焊一次性完成焊接;卧贴结构使针座平躺于PCB表面,Z轴(板上高度)仅5.6mm,适配智能手机、智能手环等薄型设备的内部空间限制。
黄铜触头与LCP外壳装配精度高,端子插拔无卡滞;锡镀层厚度均匀,焊接时无虚焊、假焊问题,降低售后故障率。
该产品因紧凑尺寸与可靠性能,广泛应用于:
讯普(XUNPU)专注连接器研发10余年,产品覆盖PH、XH等主流系列,通过ISO9001认证,所有型号均经过:
可满足客户批量生产需求,提供稳定的供货周期与技术支持。
WAFER-PH2.0-4PWB以“小间距、高可靠、贴装高效”为核心优势,是中小功率电子设备升级轻薄化设计的优选连接器。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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