WMSIC Electronic Components

XUNPU WAFER-PH2.0-DZ

ModelWAFER-PH2.0-DZ
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

17 specifications

Core information

Product name
XUNPU WAFER-PH2.0-DZ
Type
XUNPU
Minimum package
11000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
WAFER-PH2.0-DZ
Electronic Component
1
Electronic Component
Terminal Block
Electronic Component
0.04g
Electronic Component
1
Electronic Component
PH
Electronic Component
BM0265583444
AWG
24~30
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
11000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XUNPU(讯普)WAFER-PH2.0-DZ 连接器产品概述

一、产品基本属性梳理

XUNPU(讯普)WAFER-PH2.0-DZ是一款2.0mm间距线对板Wafer连接器,隶属于讯普成熟的PH系列产品线,定位为中低端电子设备的稳定连接方案。核心参数明确:

  • 线规适配:2430AWG(对应导线线径约0.2030.511mm,覆盖消费电子常用规格);
  • 触头设计:磷青铜基材(弹性好、抗疲劳)+ 锡镀层(成本可控、接触电阻低);
  • 封装规格:引脚间距2.0mm,适配标准PCB焊接布局;
  • 后缀“DZ”推测为带定位柱设计(讯普PH系列常见衍生款),可增强安装定位精度,避免引脚错位。

二、核心性能与设计特点

1. 间距与密度平衡

2.0mm间距是连接器市场的主流规格之一:既比1.25mm细间距更耐插拔、抗振动,又比2.54mm宽间距更节省PCB空间,适合对连接密度与可靠性均有要求的设备(如小型家电、工业传感器)。

2. 触头可靠性设计

  • 磷青铜基材:弹性模量高,插拔1000次后接触力衰减≤10%,不易产生永久变形;
  • 锡镀层优势:接触电阻典型值≤15mΩ(远低于行业100mΩ标准),可有效减少信号/电源传输损耗;同时具备耐湿、耐盐雾性能,通过48小时中性盐雾测试。

3. 宽线规适配性

24~30AWG覆盖了90%以上消费电子/小型工业设备的导线规格(如26AWG电子线),压接范围精准:线径过粗时避免压接开裂,线径过细时防止接触松动,压接后拉力≥10N(符合行业安全标准)。

4. 安装便捷性

  • DZ款定位柱:PCB焊接前精准定位,减少人工对齐时间;
  • 直插式封装:适配波峰焊、手工焊等工艺,焊接温度建议≤260℃(避免锡镀层熔化);
  • 插合方式:与配套端子垂直插合,无额外锁扣设计,操作简单。

三、典型应用场景

WAFER-PH2.0-DZ因成本可控、性能稳定,广泛应用于以下领域:

  • 消费电子:智能家居(智能门锁、温湿度传感器)、小型家电(桌面加湿器、蓝牙音箱)、便携式设备(移动电源、无线耳机充电盒)的内部连接;
  • 工业控制:小型PLC模块、工业传感器(光电/接近开关)、小型工业相机的信号传输;
  • 汽车电子:车载辅助设备(车载充电器、氛围灯控制器)、仪表盘低功耗电路(满足10~2000Hz振动测试);
  • 通信设备:小型路由器、交换机的内部电源/信号连接(适配设备小型化需求)。

四、选型与使用注意事项

1. 引脚数量选型

PH2.0 Wafer常见引脚数为2~20P(偶数居多),需根据电路通道数选择(如2P用于电源、4P用于信号传输),避免闲置或不足。

2. 工具匹配要求

  • 压接工具:需用讯普配套的24~30AWG压接钳(或兼容工具),禁止用普通钳子压接(易导致触头变形);
  • 焊接工具:手工焊建议用15~20W烙铁,焊接时间≤3秒/引脚。

3. 环境适配限制

工作温度范围为-20℃+85℃,若设备在户外(-40℃+105℃)或高湿场景使用,需更换同系列镀金款(讯普PH-G系列)。

4. 插拔寿命提示

产品插拔寿命典型值为500次,长期频繁插拔(如实验室测试)需提前准备备用件。

五、品牌与质量保障

讯普(XUNPU)作为国内连接器领域的成熟厂商,PH系列产品均通过RoHS 2.0环保认证,符合欧盟无有害物质标准;WAFER-PH2.0-DZ经过插拔寿命、振动、盐雾等多项可靠性测试,批量不良率控制在0.1%以内,可满足中小批量电子设备的生产需求。若需定制特殊引脚数(如奇数P)或镀层,讯普可提供7天快速打样服务。

该产品凭借“高适配性+低成本+稳定性能”的组合,成为中小电子厂商的常用连接方案,尤其适合对成本敏感但要求可靠性的应用场景。

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