Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XUNPU(讯普)WAFER-PH2.0-DZ是一款2.0mm间距线对板Wafer连接器,隶属于讯普成熟的PH系列产品线,定位为中低端电子设备的稳定连接方案。核心参数明确:
2.0mm间距是连接器市场的主流规格之一:既比1.25mm细间距更耐插拔、抗振动,又比2.54mm宽间距更节省PCB空间,适合对连接密度与可靠性均有要求的设备(如小型家电、工业传感器)。
24~30AWG覆盖了90%以上消费电子/小型工业设备的导线规格(如26AWG电子线),压接范围精准:线径过粗时避免压接开裂,线径过细时防止接触松动,压接后拉力≥10N(符合行业安全标准)。
WAFER-PH2.0-DZ因成本可控、性能稳定,广泛应用于以下领域:
PH2.0 Wafer常见引脚数为2~20P(偶数居多),需根据电路通道数选择(如2P用于电源、4P用于信号传输),避免闲置或不足。
工作温度范围为-20℃+85℃,若设备在户外(-40℃+105℃)或高湿场景使用,需更换同系列镀金款(讯普PH-G系列)。
产品插拔寿命典型值为500次,长期频繁插拔(如实验室测试)需提前准备备用件。
讯普(XUNPU)作为国内连接器领域的成熟厂商,PH系列产品均通过RoHS 2.0环保认证,符合欧盟无有害物质标准;WAFER-PH2.0-DZ经过插拔寿命、振动、盐雾等多项可靠性测试,批量不良率控制在0.1%以内,可满足中小批量电子设备的生产需求。若需定制特殊引脚数(如奇数P)或镀层,讯普可提供7天快速打样服务。
该产品凭借“高适配性+低成本+稳定性能”的组合,成为中小电子厂商的常用连接方案,尤其适合对成本敏感但要求可靠性的应用场景。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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