WMSIC Electronic Components

XUNPU FPC-05F-20PH20

ModelFPC-05F-20PH20
PackageSMD, P=0.5mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU FPC-05F-20PH20
Type
XUNPU
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XUNPU
Electronic Component
FPC-05F-20PH20
Electronic Component
1
Package
SMD, P=0.5mm
Electronic Component
FFC / FPC Connector
Electronic Component
0.461g
Electronic Component
0.5mm
Electronic Component
1
Electronic Component
BM0265062279
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Electronic Component
2mm
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
20P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

FPC-05F-20PH20 翻盖式FPC连接器产品概述

一、产品核心定位与应用场景

FPC-05F-20PH20是讯普(XUNPU)品牌推出的小间距翻盖式FPC/FFC连接器,专为轻薄化、高密度电子设备的内部信号/电源连接设计。产品聚焦“紧凑空间适配+稳定可靠连接”核心需求,针对便携设备、小型仪器等对安装空间敏感的场景,提供标准化的20Pin触点连接方案,是替代传统排线连接的高效选择。

二、关键参数与性能特点

该产品的核心参数围绕“小间距、卧贴安装、稳定连接”展开,具体如下:

  • 间距与触点:采用0.5mm标准间距,20Pin触点配置,兼顾高密度与信号传输兼容性;
  • 安装与锁定:卧贴SMD封装,板上高度仅2mm(行业内轻薄水平),搭配翻盖式下接触锁定结构,操作简便且连接牢固;
  • 适配与机械:兼容0.3mm厚度的FFC/FPC柔性电缆,触头材质为磷青铜(具备良好弹性与导电性),镀层为锡(耐氧化、成本可控);
  • 电气与环境:额定电压50V AC/DC,额定电流500mA(单触点),工作温度范围-25℃至+85℃,满足常规电子设备的环境需求。

三、设计优势与可靠性

  1. 空间极致优化:卧贴SMD封装无需插件孔,板上高度2mm,可大幅减少设备内部垂直空间占用,尤其适合智能手机、智能手表等“超薄”产品的内部模块连接;
  2. 连接稳定性:翻盖式下接触结构通过按压翻盖实现电缆锁定,避免传统掀盖式的误开风险,同时下接触设计可减少电缆弯曲应力对触点的影响,提升连接可靠性;
  3. 电气性能可靠:磷青铜触头的弹性可保证与FPC电缆的紧密接触,锡镀层则降低接触电阻(通常≤30mΩ),减少信号衰减,同时具备一定的耐插拔能力(常规插拔≥50次);
  4. 环境适应性:宽温范围覆盖了多数消费电子、工业小模块的工作环境,无需额外的环境防护即可稳定运行;
  5. 适配性强:兼容0.3mm标准FFC/FPC电缆,20Pin触点可满足单排信号(如数据传输、电源供电)的集中连接需求,无需多组连接器拼接。

四、安装与适配说明

  • 安装工艺:采用回流焊工艺,焊接温度需符合SMD封装的标准曲线(通常峰值温度240-260℃,时间≤10s),避免高温损坏触头;
  • 电缆适配:必须使用0.3mm厚度、0.5mm间距、20Pin的FFC/FPC电缆,插入时需确认电缆方向(通常有定位标识),翻盖锁定时需按压至“咔哒”声,确保完全锁定;
  • 注意事项:安装前需清理PCB板焊盘,避免异物影响焊接质量;插拔电缆时需先翻开翻盖,再轻拉电缆,禁止直接拉扯电缆导致触头损坏。

五、典型应用领域

FPC-05F-20PH20的设计特性使其在多个领域具备广泛应用:

  1. 便携消费电子:智能手机副屏与主板连接、智能手表的传感器模块连接、蓝牙耳机的电池与主板连接;
  2. 小型医疗仪器:便携式血糖仪的显示屏与主板连接、小型监护仪的传感器模块排线;
  3. 智能家居设备:智能门锁的指纹模块与控制板连接、智能音箱的麦克风阵列排线;
  4. 工业控制小模块:微型PLC的输入输出模块连接、小型传感器(如温湿度传感器)的信号传输;
  5. 消费电子配件:移动电源的电池组与控制板连接、无线充电器的线圈与主板连接。

六、产品总结

FPC-05F-20PH20通过“小间距+卧贴+翻盖锁定”的组合设计,平衡了高密度连接、空间优化与可靠性,是轻薄电子设备内部FPC/FFC连接的高性价比选择。讯普品牌的标准化生产确保了产品一致性,可满足批量生产的需求,同时适配多数主流电子设备的设计规范。

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