WMSIC Electronic Components

XUNPU WAFER-GH1.25-5PWB

ModelWAFER-GH1.25-5PWB
PackageSMD,P=1.25mm
BrandXUNPU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XUNPU WAFER-GH1.25-5PWB
Type
SMD, P=1.25MM
Minimum package
1000

Technical parameters

Electronic Component
XUNPU
Electronic Component
WAFER-GH1.25-5PWB
Electronic Component
1
Package
SMD,P=1.25mm
Electronic Component
1
Electronic Component
Wire-to-Board
Electronic Component
0.5g
Electronic Component
1.25mm
Electronic Component
Electronic Component
PIN
5P
Electronic Component
1
Electronic Component
GH
Electronic Component
BM0265062286
Electronic Component
LCP
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

WAFER-GH1.25-5PWB线对板针座产品概述

一、产品基本定位

WAFER-GH1.25-5PWB是讯普(XUNPU) 推出的GH系列线对板针座,针对小间距、高密度电路连接场景设计,采用1排5针(1×5P)、1.25mm间距的卧贴式SMD封装,专为小功率信号与低功率电源的稳定传输打造,适配消费电子、工业控制等多领域的小型化设备需求。

二、核心技术参数

该产品的核心参数覆盖常规应用场景的关键需求:

  • 电气性能:额定电流1A(适配小功率信号/电源传输),额定电压125V(AC/DC通用);
  • 环境适应性:工作温度范围-25℃~+85℃,可应对低温环境、常规高温工作及短期焊接高温;
  • 材料特性:触头采用黄铜(导电率与机械弹性平衡),表面镀锡(焊接性优异+抗氧化);塑料外壳为LCP(液晶聚合物)(耐温变形、尺寸稳定);
  • 封装规格:1×5P单排针,卧贴SMD封装,带辅助焊脚。

三、结构设计与尺寸

  1. 插针与安装:1×5P单排插针结构,符合GH系列小间距规范;卧贴式SMD安装(贴装于PCB表面),无需通孔,节省PCB背面空间,同时适配SMT自动化贴装工艺;
  2. 辅助焊脚设计:额外增加辅助焊脚,显著增强针座与PCB的焊接结合力,有效抵抗振动、外力拉扯,降低脱落风险;
  3. 紧凑尺寸:板上高度(Z轴)仅4.35mm,底边长度(X轴,沿间距方向)9.5mm,底边宽度(Y轴)5mm,整体尺寸适配小型化设备的高密度布局。

四、材料与工艺特性

  • 触头:黄铜材质兼具良好导电率与机械弹性,确保插拔时接触压力稳定;表面镀锡处理,既提升焊接性(适配常规焊料),又防止触头氧化,延长使用寿命;
  • 塑料外壳:LCP材料耐温性能优异(可承受SMT焊接短期高温),尺寸稳定性强,宽温环境下不易变形,保证针座与排线的精准配合;
  • 外观:米色外壳便于生产过程中的识别与检测,提升组装效率。

五、典型应用场景

该产品因尺寸紧凑、可靠性高,广泛适用于:

  1. 消费电子:智能穿戴(手环/手表的传感器与主板连接)、小型家电(电动牙刷/加湿器的控制板连接);
  2. 工业控制:小型PLC模块、传感器节点的线对板接口;
  3. 通讯设备:小型路由器、无线模块的内部电路连接;
  4. 低功率车载:车载充电器、氛围灯控制器的内部连接(适配-25℃~+85℃环境)。

六、产品优势总结

  1. 小间距省空间:1.25mm间距有效节省PCB面积,助力设备小型化;
  2. 自动化适配:卧贴SMD封装支持SMT自动化贴装,提升生产效率、降低人工成本;
  3. 高可靠性:辅助焊脚+黄铜镀锡触头,确保接触稳定、焊接牢固,长期使用故障率低;
  4. 宽温适应性:LCP塑料与-25℃~+85℃温区,满足不同环境下的稳定工作;
  5. 精准配合:严格尺寸控制(Z轴4.35mm等),保证与配套排线的精准插拔,减少接触不良。

该产品凭借以上特性,成为小间距线对板连接场景的高性价比选择,适配多数常规电子设备的集成需求。

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