WMSIC Electronic Components

XBLW XBL1509-5.0 XBL1509

ModelXBL1509-5.0
PackageSOP-8
BrandXBLW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XBLW XBL1509-5.0
Type
XBLW
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XBLW
Electronic Component
XBL1509-5.0
Electronic Component
1
Package
SOP-8
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.197g
Electronic Component
1
Features
Electronic Component
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0229299191
Operating Temperature
40℃~+125℃
Operating Voltage
7V~40V
Switching Frequency
150kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XBL1509-5.0 产品概述

一、概述

XBL1509-5.0 是芯伯乐(XBLW)推出的一款固定输出电压降压型开关稳压器,输出固定为 5.0V,单通道设计,适用于 7V40V 的宽输入电压范围。器件集成开关管(内置),采用 SOP-8 封装,适合中功率点到功率密度要求较高的工业与车载类应用。工作环境温度范围为 -40℃+125℃,器件以简化外围电路为目标,便于快速应用落地。

二、主要参数

  • 输出类型:固定(5.0V)
  • 拓扑结构:降压(Buck)
  • 同步整流:否(需外接整流二极管)
  • 开关管:内置
  • 输出电流:最大 3A
  • 工作电压:7V ~ 40V
  • 开关频率:150kHz
  • 静态电流(Iq):约 5mA
  • 输出通道数:1
  • 工作温度:-40℃ ~ +125℃
  • 封装:SOP-8

三、功能与特点

  • 宽输入电压范围,覆盖常见 12V/24V 以及更高电压系统。
  • 固定 5V 输出,便于给单片机、逻辑电路和外围模块供电。
  • 内置高压开关管,外围元件较少,简化设计与装配。
  • 非同步整流架构,需配合低压降快速整流二极管(建议选用低 Vf、大电流肖特基管)。
  • 低静态电流(Iq ≈ 5mA),利于降低待机损耗。

四、典型应用场景

  • 汽车电子(车载电源模块、仪表、传感器供电)
  • 工业控制与自动化设备
  • 通信设备电源前端
  • 嵌入式系统与单板计算模块电源

五、设计与布局建议

  • 输入侧需配置低 ESR 电解或固态电容,务必将输入电容尽量靠近芯片 VIN 引脚布置以抑制开关尖峰。
  • 由于为非同步整流,整流二极管选择十分关键:选用额定电流 ≥3A、低正向压降的肖特基二极管以降低功耗与发热。
  • 输出电容采用低 ESR 类型(固态或陶瓷与电解并联),保证输出纹波与瞬态响应。
  • 开关频率 150kHz 在 EMI 与器件尺寸间做平衡,若需进一步降低 EMI 可加差模/共模滤波。
  • SOP-8 封装热阻相对较大,建议在 PCB 下方做充足的铜箔铺铜或接地过孔以增强散热,必要时考虑加散热片或热铜柱。

六、注意事项与选型建议

  • 若系统对效率或发热要求较高,建议考虑同步整流型器件以减少整流损耗;但若追求外围简单、成本可控,XBL1509-5.0 是合适选择。
  • 在高温或高负载场景下,应验证热降额与稳态温升,保证在最大工作温度下仍有足够余量。
  • 在设计前请参考器件最新数据手册与典型应用电路,以确认引脚分配、外围元件推荐及保护特性(例如软启动、过流/过温处理)等细节。

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