WMSIC Electronic Components

XBLW SN74LS86N

ModelSN74LS86N(XBLW)
PackageDIP-14
BrandXBLW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XBLW SN74LS86N(XBLW)
Type
XBLW
Minimum package
25 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XBLW
Electronic Component
SN74LS86N(XBLW)
Electronic Component
1
Package
DIP-14
Electronic Component
Logic Gate
Electronic Component
74LS
Electronic Component
1.645g
Electronic Component
1
Channel Count
4
Features
Electronic Component
Electronic Component
BM0265583745
Operating Temperature
20℃~+85℃
Operating Voltage
2V~6V
Logic Type
Gate
Current(IOH)
5.2mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SN74LS86N(芯伯乐XBLW)四异或门产品概述

一、产品核心定位

SN74LS86N是芯伯乐(XBLW)推出的74LS系列四异或门逻辑器件,采用DIP-14双列直插封装,属于经典TTL逻辑电路范畴。该器件集成4个独立的2输入异或门通道,兼具高速运算、宽电压适配、低功耗三大核心优势,可广泛替代传统74LS86器件,适用于通用数字逻辑系统、数据处理、通信设备等场景,是原型开发与批量生产的可靠选择。

二、关键性能参数总览

该器件的核心参数覆盖逻辑功能、电气性能与工作条件,关键亮点包括:

  1. 逻辑功能:4通道2输入异或门(XOR),每个通道实现「输入不同则输出1,相同则输出0」的运算;
  2. 电源适配:工作电压范围2V~6V,兼容3.3V低电压与传统5V TTL系统;
  3. 低功耗:静态电流(Iq)仅2μA,待机功耗显著低于普通TTL器件;
  4. 驱动能力:灌电流(IOL)与拉电流(IOH)均为5.2mA,可驱动多个TTL负载或小功率外设;
  5. 高速响应:传播延迟(tpd)11ns(@6.0V、15pF负载),满足中等速度数字系统需求;
  6. 环境适应:工作温度范围**-20℃~+85℃**,符合工业级应用要求。

三、电气特性详细说明

1. 输入特性

  • 输入高电平(VIH):1.2V~3.2V,覆盖TTL/CMOS逻辑电平,兼容性强;
  • 输入低电平(VIL):800mV~2.8V,输入阈值稳定,抗干扰能力较好;
  • 通道配置:每个异或门为2输入,4个通道独立工作,无交叉干扰。

2. 输出特性

  • 输出高电平(VOH):2V~5.81V(随电源电压变化),确保驱动后续逻辑电路时保持有效高电平;
  • 输出低电平(VOL):典型值100mV,最大值260mV,低电平噪声裕量充足;
  • 驱动能力:5.2mA灌/拉电流,可直接驱动LED(需限流电阻)、小型继电器等外设。

3. 电源与延迟特性

  • 工作电压:2V~6V宽范围,支持电池供电(如2.5V)与市电供电(5V);
  • 静态电流:2μA(典型值),待机状态下几乎不消耗额外功率;
  • 传播延迟:11ns(@6.0V、15pF负载),信号从输入到输出的延迟时间短,保证逻辑运算实时性。

四、工作环境与封装形式

1. 工作温度

  • 范围:-20℃~+85℃,可在户外、车间等工业环境稳定运行,无需额外散热措施。

2. 封装形式

  • DIP-14双列直插封装:引脚间距2.54mm,适配标准面包板、通孔焊接工艺,便于原型开发(学生实验、工程师快速验证)与批量生产调试,无需特殊焊接设备。

五、典型应用场景

SN74LS86N的异或门特性使其在多个领域发挥核心作用:

  1. 数据比较:用于二进制数据/信号比较,异或结果为1表示输入不同,可实现错误检测(如通信数据校验);
  2. 奇偶校验:作为奇偶校验发生器(生成奇偶位)或检测器(验证数据完整性),广泛应用于存储系统、串口通信;
  3. 逻辑运算:参与二进制加法器(半加器核心逻辑)、减法器等运算电路的构建;
  4. 伪随机数生成:通过异或门与移位寄存器组合,生成简单伪随机序列,用于加密、测试信号源;
  5. 数字通信:在编码/解码电路中实现扰码、解扰功能,提升数据传输抗干扰性;
  6. 原型开发:DIP封装便于面包板搭建,是电子设计竞赛、课程实验的常用器件。

该器件凭借成熟的74LS工艺与稳定的性能,成为数字逻辑系统中异或运算的经典选择,可满足从原型验证到批量生产的全流程需求。

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