WMSIC Electronic Components

XBLW LM1875T

ModelLM1875T(XBLW)
PackageTO-220B
BrandXBLW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XBLW LM1875T(XBLW)
Type
XBLW
Minimum package
50 管装

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XBLW
Electronic Component
LM1875T(XBLW)
Electronic Component
1
Package
TO-220B
Electronic Component
Audio Power Amplifier
Electronic Component
2.637g
Electronic Component
1
Electronic Component
BM0229284493
Operating Voltage
16V~50V
Output Power
25W
Static Current(Iq)
70mA
Electronic Component
Electronic Component
Electronic Component
50
Power Supply (PSRR)
83dB;95dB
+ (THD+N)
0.015%

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM1875T (XBLW 芯伯乐) 产品概述

一、产品简介

LM1875T(XBLW 芯伯乐)是一款面向高保真音频放大的功率放大器芯片,封装为 TO-220B,适合用于小型功率放大模块与嵌入式音频放大器。器件以低失真、较高输出功率与良好的电源抑制性能为特点,便于用于家庭音响、主动音箱与各类音频前后级放大场合。

二、主要参数

  • 静态电流(Iq):70 mA(典型值)
  • 输出功率:25 W(典型,视供电电压与负载而定)
  • 工作电压范围:16 V ~ 50 V
  • 总谐波失真 + 噪声(THD+N):0.015%(典型,指标优良)
  • 电源纹波抑制比(PSRR):约 83 dB ~ 95 dB(随频率与工作条件变化)
  • 封装:TO-220B,便于散热与板端安装
  • 品牌:XBLW(芯伯乐)

三、功能与特性

  • 低失真:THD+N 仅 0.015%,还能在较高输出功率下保持良好的线性表现,适合高保真音频重放。
  • 宽工作电压:支持 16~50V 电源,灵活适配不同供电架构(需按实际供电条件评估输出功率与功耗)。
  • 良好抑制:高 PSRR 值有助于减少电源纹波对音频信号的影响,改善音质纯净度。
  • 低静态功耗:70 mA 的静态电流有利于在待机与低功耗场景下降低能耗(但仍需考虑散热)。
  • 封装友好:TO-220B 便于外挂散热器,适合中功率音频放大模块化设计。

四、典型应用场景

  • 桌面/台式高保真音箱放大模块
  • 有源书架音箱与小型家庭音响系统
  • 乐器前级与轻功率舞台放大器
  • 各类需要低失真、大动态的模拟音频输出场合

五、布局与散热建议

  • 散热:25W 输出下器件会产生显著热量,建议配套合适面积的散热片并使用导热硅脂。安装时注意金属背板的电位关系,必要时使用绝缘垫片。
  • 电源去耦:电源端采用近端大容量电解/铝聚合电容(例如 470 μF ~ 2200 μF)并并联高频 0.1 μF 陶瓷,能有效抑制低频与高频纹波。
  • 输入/输出:输入侧建议用耦合电容与合理的阻容滤波以隔离直流与抑制噪声;输出侧按参考设计布置短路保护或保险元件以提高可靠性。
  • 布线与接地:模拟地与电源地分区、尽量短、粗导线连接功率回路,避免将敏感信号线与大电流回路并行布线。

六、使用注意事项

  • 供电选择:虽然器件工作电压上限可达 50V,但实际输出功率、功耗及散热需求会随电压增大显著变化,设计时需评估器件功耗与外部散热能力。
  • 负载匹配:输出功率以特定负载阻抗(如 8Ω)为依据,驱动低阻抗扬声器时需注意电流和热耗限制。
  • 保护与可靠性:建议在系统层面加入短路、过流与过温保护设计,提升整机可靠性。

LM1875T(XBLW)以其低失真、高 PSRR 与方便散热的 TO-220B 结构,适合对音质有要求的中小功率音频放大场合。设计时重视电源与散热管理,能获得稳定且高保真的输出表现。

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