WMSIC Electronic Components

XBLW INA180A1IDBVR

ModelINA180A1IDBVR(XBLW)
PackageSOT-23-5
BrandXBLW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XBLW INA180A1IDBVR(XBLW)
Type
XBLW
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XBLW
Electronic Component
INA180A1IDBVR(XBLW)
Electronic Component
20V/V
Electronic Component
1
Package
SOT-23-5
Electronic Component
350kHz
Electronic Component
Current Sense Amplifier
Electronic Component
0.046g
Electronic Component
1
Common Mode Voltage
200mV~30V
Electronic Component
BM0265609067
Operating Temperature
40℃~+125℃
Voltage
±30V
Amplifier
1
Output Current
8mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

INA180A1IDBVR(XBLW芯伯乐)精密运算放大器产品概述

一、核心定位与应用场景

INA180A1IDBVR是XBLW(芯伯乐)推出的单路精密运算放大器,专为低功耗、宽环境适应性的信号调理场景设计。产品聚焦工业控制、汽车电子、电池管理系统(BMS)及便携式设备等领域,通过优化的输入特性、宽电源/共模电压范围及小型化封装,满足多种微弱信号放大与抗干扰需求,是替代传统双电源运放的高性价比选择。

二、关键性能参数深度解析

1. 增益与带宽特性

产品采用固定增益20V/V设计,无需外部电阻校准,简化电路布局;350kHz的增益带宽积(GBW)可覆盖中等频率(kHz级)信号的放大需求,适用于大多数传感器输出信号(如压力、温度传感器的动态响应信号),避免高频信号失真。

2. 输入精度与稳定性

  • 低失调与温漂:25uV的输入失调电压(Vos)结合1uV/℃的温漂,确保宽温度范围内信号放大的精度稳定(如-40℃~+125℃内,总失调变化≤175uV);
  • 低偏置/失调电流:75uA输入偏置电流(Ib)与0.05uA输入失调电流(Ios),对高阻抗输入信号(如无源传感器输出)的负载效应极小,避免信号失真。

3. 噪声与动态性能

  • 低噪声密度:1kHz下40nV/√Hz的电压噪声,可有效放大μV级微弱信号(如热电偶、应变片输出),减少放大后的噪声干扰;
  • 动态响应:2V/us的压摆率(SR)满足中等速度信号的线性放大,8mA输出电流可驱动小负载(如ADC输入、LED指示电路),无需额外驱动级。

4. 共模与电源适应性

  • 宽共模电压:-200mV~30V范围,支持高压侧信号监测(如电池组正极侧电流检测);±30V差分电压范围,确保输入过载时的安全性;
  • 单电源兼容:2.7~5.5V单电源工作,兼容便携式设备(手机、平板)及工业系统电源,无需双电源,简化电路设计;
  • 低功耗:175uA静态电流(Iq),实现低功耗运行,延长电池设备续航。

三、封装与设计灵活性

产品采用SOT-23-5小型封装(典型尺寸2.9mm×1.6mm),尺寸紧凑,适合高密度PCB布局(如BMS模块、便携式设备主板);单电源设计无需额外负电源电路,降低系统成本与体积,提升设计灵活性。

四、环境适应性与可靠性

  • 宽温范围:工作温度-40℃+125℃,满足工业级(-4085℃)及汽车级(-40~125℃)环境要求,可在极端温度下稳定工作;
  • 高抗干扰:100dB共模抑制比(CMRR),有效抑制电网噪声、电磁辐射等共模干扰,提升恶劣环境下的信号精度。

五、典型应用场景

  1. 电池管理系统(BMS):宽共模电压支持电池组(电动车、储能电池)正极侧电流检测,低噪声与温漂确保mA级电流精确测量;
  2. 工业传感器调理:适用于压力、温度、应变片等传感器信号放大,低偏置电流避免高阻抗信号失真;
  3. 汽车电子:宽温与抗干扰能力,可用于胎压监测、发动机温度传感器的信号调理;
  4. 便携式设备:低功耗与单电源设计,适合智能手环、便携式医疗设备的信号放大,延长续航。

总结

INA180A1IDBVR通过优化的性能参数、宽环境适应性及小型化封装,成为工业控制、汽车电子、BMS等领域的高性价比精密运放选择,可有效提升系统信号精度与可靠性,简化电路设计流程。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.