WMSIC Electronic Components

XBLW SN74HC160N

ModelSN74HC160N(XBLW)
PackageDIP-16
BrandXBLW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XBLW SN74HC160N(XBLW)
Type
XBLW
Minimum package
25 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XBLW
Electronic Component
SN74HC160N(XBLW)
Electronic Component
1
Package
DIP-16
Electronic Component
Counter / Divider
Electronic Component
1.661g
Electronic Component
Electronic Component
Electronic Component
1
Features
positions;; Synchronous
Electronic Component
BM0265621909
Reset
Electronic Component
Operating Temperature
40℃~+105℃
Operating Voltage
2V~6V
Electronic Component
66MHz
Electronic Component
Synchronous

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SN74HC160N(芯伯乐XBLW)十进制同步计数器产品概述

一、产品核心定位

SN74HC160N是芯伯乐(XBLW)推出的高速CMOS十进制同步计数器,兼容传统74HC160的功能与引脚定义。该产品以「异步清零+同步计数」为核心特性,兼具宽电压范围、高速响应与工业级宽温适应性,适用于工业计数、频率分频、数字仪表等场景,是原型开发、批量生产的高性价比选择。

二、关键电气特性解析

芯伯乐SN74HC160N的参数经过场景化优化,满足多元需求:

  • 宽电压适配:2V~6V输入电压,无缝兼容3.3V低功耗系统(如嵌入式MCU)或5V工业逻辑,无需电平转换,简化系统设计;
  • 高速计数能力:最大计数速率达66MHz,支持高频脉冲(如生产线传感器信号)的精准计数;
  • 精准时序性能:传播延迟(tpd)仅18ns,信号传输响应快,减少级联计数的累计误差;
  • 异步清零机制:低电平有效异步清零(MR引脚),无需等待时钟沿即可立即清零,提升系统响应速度;
  • 工业级宽温:工作温度覆盖-40℃~+105℃,可在户外设备、高温控制柜等恶劣环境稳定运行。

三、功能特性详解

该计数器集成实用功能,支持灵活计数:

  1. 十进制同步计数:采用4位BCD码输出(0000~1001),计数过程同步进行,避免异步计数的尖峰脉冲,提升抗干扰能力;
  2. 并行置数:低电平有效并行置数(LOAD引脚),配合时钟上升沿生效,可快速设置初始计数值(如直接置为5);
  3. 双使能控制:提供ENP(计数使能)和ENT(进位使能)双端,仅当两者均为高电平时,计数器随时钟上升沿计数,方便启停控制;
  4. 进位输出:计数至9(1001)且ENT为高时,RCO引脚输出高电平进位,支持多片级联(如2片实现0~99计数)。

四、封装与引脚配置

SN74HC160N采用DIP-16直插封装,引脚与标准74HC160一致,便于替换与原型开发:

  • 核心引脚说明:
    • 1脚(MR):异步清零(低电平有效);
    • 2脚(CLK):时钟输入(上升沿触发);
    • 3脚(ENP)、4脚(ENT):计数使能端;
    • 57脚、9脚(D0D3):并行置数输入;
    • 1114脚(Q3Q0):BCD码输出(Q3为最高位);
    • 15脚(RCO):进位输出;
    • 8脚(GND)、16脚(VCC):电源与地。
  • 直插优势:无需特殊焊接设备,手工焊接便捷,适合教学实验、小批量原型制作。

五、典型应用场景

该产品适配多场景需求:

  • 工业计数:生产线产品数量统计、机械编码器脉冲计数;
  • 频率分频:将66MHz高频信号分频为6.6MHz、1MHz等低频信号,用于时钟同步;
  • 数字仪表:电能表、水表的十进制计数单元,配合显示电路实现数值显示;
  • 教学实验:电子电路课程中同步计数原理演示,帮助理解逻辑时序;
  • 嵌入式辅助:配合MCU实现外部事件计数(如按键次数、传感器脉冲),减轻MCU运算负担。

六、可靠性与兼容性

SN74HC160N兼容标准74HC160的功能与引脚,可直接替换同类产品;具备静电防护(ESD)能力(符合IEC 61000-4-2标准),降低生产损坏风险;存储温度范围为-65℃~+150℃,满足长期存储需求。

芯伯乐SN74HC160N以稳定性能与灵活应用,成为十进制计数场景的实用选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.