WMSIC Electronic Components

XBLW SN74LS21N

ModelSN74LS21N(XBLW)
PackageDIP-14
BrandXBLW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XBLW SN74LS21N(XBLW)
Type
XBLW
Minimum package
25 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XBLW
Electronic Component
SN74LS21N(XBLW)
Electronic Component
1
Package
DIP-14
Electronic Component
Logic Gate
Electronic Component
74LS
Electronic Component
1.485g
Electronic Component
1
Channel Count
2
Electronic Component
BM0265621954
Operating Temperature
20℃~+85℃
Operating Voltage
2V~6V
Logic Type
and Gate
Current(IOH)
5.2mA
Current(IOL)
5.2mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SN74LS21N(XBLW芯伯乐)产品概述

SN74LS21N是芯伯乐(XBLW)推出的双4输入与门TTL逻辑器件,属于经典74LS低功耗肖特基系列,兼容传统SN74LS21N的电气特性与引脚布局,兼具低功耗、高速响应及宽温适应性,适用于多种通用数字逻辑电路场景。

一、核心逻辑功能与定位

该器件集成2个独立的4输入与门,每个门的逻辑规则为:仅当4个输入引脚均为高电平时,输出引脚才输出高电平;若任意一个输入为低电平,则输出为低电平。作为经典TTL组合逻辑单元,其核心作用是实现多条件(4输入)的逻辑与判断,是构建复杂数字电路(如译码器、编码器、触发电路)的基础模块。

二、关键电气参数解析

1. 工作电压与功耗

  • 工作电压范围:2V~6V,覆盖常见TTL逻辑电平(以5V为典型工作电压),兼容不同电源系统的电压波动;
  • 静态电流(Iq):仅20μA,属于低功耗设计,可降低系统待机功耗,适合对功耗敏感的小型设备(如电池供电的简易控制模块)。

2. 驱动能力

  • 灌电流(IOL):5.2mA,拉电流(IOH):5.2mA,具备中等负载驱动能力,可直接驱动LED(串联限流电阻)、小型继电器线圈或其他TTL逻辑门,无需额外驱动电路。

3. 输入输出电平特性

输入输出电平随工作电压动态适配,典型参数清晰明确:

  • 输入高电平(VIH):2V时≥1.5V,5V时≥4.2V,保证高电平输入的可靠性;
  • 输入低电平(VIL):2V时≤500mV,5V时≤1.35V,低电平输入阈值明确;
  • 输出高电平(VOH):典型值为电源电压减0.1V~0.2V(如5V时≈4.9V),输出低电平(VOL)≤330mV,输出电平清晰,减少逻辑误判。

4. 速度与温度适应性

  • 传播延迟(tpd):19ns(@6V、50pF负载),响应速度快,满足中等高速数字系统(如简单时序逻辑、数据选通)的时序要求;
  • 工作温度:-20℃~+85℃,符合工业级温度标准,可在户外、车间等宽温环境下稳定工作。

三、封装与物理特性

采用DIP-14(双列直插式14引脚) 封装,引脚布局与标准SN74LS21N完全一致:

  • 引脚14:第一个与门的4个输入(A1A4);
  • 引脚5:第一个与门输出(Y1);
  • 引脚6:第二个与门输出(Y2);
  • 引脚7:接地(GND);
  • 引脚912:第二个与门的4个输入(B1B4);
  • 引脚14:电源(VCC);
  • 引脚8:空脚(NC)。

DIP封装便于手工焊接、面包板原型搭建,同时兼容批量生产中的插件组装工艺,适合从实验室原型到工业量产的全流程应用。

四、典型应用场景

  1. 数字逻辑组合电路:作为多条件判断单元,用于构建译码器(如4输入地址译码)、编码器、逻辑门阵列等基础模块;
  2. 工业控制模块:宽温范围适配车间、户外设备,低功耗适合小型控制单元(如电机启停逻辑判断);
  3. 教学实验与原型开发:经典TTL器件,DIP封装便于学生实验操作,帮助理解组合逻辑的基本原理;
  4. 高速信号选通:19ns传播延迟可用于简单的信号选通、时序触发(如多通道数据同步判断)。

五、品牌与可靠性

芯伯乐(XBLW)作为国产半导体品牌,其SN74LS21N器件严格遵循74LS系列标准,电气参数与引脚布局完全兼容进口SN74LS21N,经工业级可靠性测试(如温度循环、振动、静电防护),可稳定替代进口器件,降低系统成本的同时保证性能一致性。

综上,SN74LS21N(XBLW)以低功耗、高速、宽温适配及经典TTL兼容性为核心优势,是数字电路设计中实现4输入与逻辑的可靠选择,覆盖从教学实验到工业应用的多场景需求。

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