WMSIC Electronic Components

XBLW SN74HC32N

ModelSN74HC32N(XBLW)
PackageDIP-14
BrandXBLW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XBLW SN74HC32N(XBLW)
Type
XBLW
Minimum package
25 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XBLW
Electronic Component
SN74HC32N(XBLW)
Electronic Component
1
Package
DIP-14
Electronic Component
Logic Gate
Electronic Component
74HC
Electronic Component
1.616g
Electronic Component
1
Channel Count
4
Features
Electronic Component
Electronic Component
BM0265621906
Operating Temperature
40℃~+105℃
Operating Voltage
2V~6V
Logic Type
Gate
Current(IOH)
5.2mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SN74HC32N(XBLW)4通道2输入或门逻辑器件产品概述

一、产品核心定位与逻辑功能

SN74HC32N(XBLW品牌)属于74HC系列高速CMOS逻辑器件,是一款4通道独立2输入或门,专为数字逻辑运算、电平转换及低功耗场景设计。其核心功能为对4组2输入信号执行“或”逻辑运算:

  • 任意一组输入(A、B)中至少一个为高电平时,对应输出(Y)为高电平;
  • 仅当两组输入均为低电平时,输出才为低电平。

该器件兼容TTL电平接口,可与传统74LS系列器件直接配合,同时具备CMOS工艺的低功耗优势,是工业控制、消费电子等领域的通用逻辑器件。

二、关键电气参数详解

SN74HC32N的参数平衡了高速性能与低功耗,核心参数及实际意义如下:

参数类型 典型值/范围 应用价值 工作电压 2V~6V 适配2.5V/3.3V/5V等主流电源系统 静态电流(Iq) 2μA 远低于TTL器件,适合电池供电的便携式设备 驱动能力 灌电流4mA、拉电流5.2mA 可直接驱动LED、小型继电器,无需额外驱动 输入电平 VIH:1.5V/3.15V/4.2V;VIL:≤500mV/1.35V/1.8V 兼容不同电压域的输入信号 输出电平 VOH:4.32V(接近电源);VOL:100mV 输出电平稳定,抗干扰能力强 传播延迟(tpd) 6ns 满足高频数字信号处理(如计数器、编码器) 工作温度 -40℃~+105℃ 适应工业车间、户外设备的温度变化

三、封装与引脚配置

SN74HC32N采用DIP-14直插封装,引脚布局清晰,便于手工焊接与原型开发,具体功能如下:

引脚编号 功能描述 引脚编号 功能描述 1 通道1输入A(1A) 8 通道3输入B(3B) 2 通道1输入B(1B) 9 通道3输入A(3A) 3 通道1输出(1Y) 10 通道3输出(3Y) 4 通道2输入A(2A) 11 通道4输入A(4A) 5 通道2输入B(2B) 12 通道4输入B(4B) 6 通道2输出(2Y) 13 通道4输出(4Y) 7 电源地(GND) 14 电源正(VCC)

注:4组通道完全独立,可单独使用(如仅用1组)或组合扩展逻辑功能。

四、典型应用场景

因参数优势,SN74HC32N广泛应用于以下场景:

  1. 工业控制:PLC、传感器信号处理(如多传感器“或”触发报警);
  2. 电平转换:3.3V单片机与5V外设(如继电器、LED)的信号兼容;
  3. 电池设备:便携式医疗仪器、遥控器(低静态电流延长续航);
  4. 高速电路:高频计数器、编码器(6ns延迟保证信号实时性);
  5. 消费电子:智能插座、玩具的逻辑控制(如按键“或”触发);
  6. 汽车电子:车载辅助电路(宽温范围适应车内温度变化)。

五、可靠性与兼容性

该器件采用CMOS工艺,具备以下可靠性优势:

  • 抗干扰强:高输入阻抗减少噪声影响,适合电磁环境复杂的工业场景;
  • 静电防护:符合IEC 61000-4-2标准,可承受±2kV接触放电;
  • 替换兼容:与SN74LS32、SN74HC32等同类器件引脚完全兼容,可直接替换;
  • 长寿命:DIP封装耐插拔,宽温范围提升长期稳定性。

总结

SN74HC32N(XBLW)是一款高性价比的4通道或门逻辑器件,平衡了高速、低功耗、宽温与兼容性,覆盖工业控制、消费电子等多领域需求,是数字电路设计的通用选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.