WMSIC Electronic Components

XBLW LM386DTR

ModelLM386DTR(XBLW)
PackageSOP-8
BrandXBLW
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XBLW LM386DTR(XBLW)
Type
XBLW
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XBLW
Electronic Component
LM386DTR(XBLW)
Electronic Component
1
Package
SOP-8
Electronic Component
Audio Power Amplifier
Electronic Component
0.2g
Electronic Component
1
Features
Analog Voltage
Electronic Component
BM0265621921
Operating Temperature
0℃~+70℃
Operating Voltage
4V~12V
Static Current(Iq)
4mA
Electronic Component
Electronic Component
Electronic Component
2500
Power Supply (PSRR)
50dB

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LM386DTR(XBLW芯伯乐)音频功率放大器产品概述

LM386DTR是芯伯乐(XBLW)针对低压便携音频放大场景优化设计的音频功率放大器,凭借宽电压范围、低失真、超低静态功耗等核心特性,成为小型音频设备的理想选择。产品兼顾音质纯净度与电池续航能力,适配多种应用场景,是消费电子、玩具、车载音频等领域的高性价比方案。

一、产品定位与核心特性

LM386DTR定位于电池供电/小体积音频功率放大,核心特性围绕便携设备的“低功耗、高抗扰、小体积”需求设计:

  • 宽电压兼容:4V~12V输入范围,覆盖3节AA(4.5V)、4节AA(6V)、单节锂电池(4.2V满电)及12V车载电源,无需额外电源转换;
  • 低失真降噪:总谐波失真+噪声(THD+N)仅0.2%,远低于人耳可感知的失真阈值(>1%),保证音频还原度;
  • 超低静态功耗:静态电流(Iq)4mA,较同类产品(部分>10mA)续航提升2~3倍,适合长期待机设备;
  • 高电源抗扰:电源纹波抑制比(PSRR)50dB,可将1V电源纹波抑制至输出端3mV以内,减少噪声干扰;
  • 小体积封装:SOP-8贴片封装,节省PCB空间,适配小型化产品(如蓝牙音箱、发声玩具)。

二、关键电气参数深度解析

1. 工作电压范围(4V~12V)

覆盖主流便携设备供电场景:

  • 低电压端:兼容3节AA/AAA电池(4.5V)、单节锂电池(3.7V~4.2V),满足入门级便携音频需求;
  • 高电压端:支持12V直流电源/车载电源,适配户外扩音、车载辅助音频等场景;
  • 无需升压/降压电路,简化系统设计,降低物料成本。

2. 总谐波失真+噪声(THD+N=0.2%)

THD+N是音频信号失真与噪声的总和占比,0.2%的数值意味着:

  • 语音、音乐等信号的失真可忽略,适合对音质有基本要求的应用(如蓝牙音箱、教学扩音器);
  • 相比部分普通LM386产品(THD+N>0.5%),音质纯净度提升显著。

3. 静态电流(Iq=4mA)

待机状态仅消耗4mA电流,核心价值:

  • 延长电池续航:以1000mAh锂电池为例,待机时间可达250小时,满足便携设备长期使用需求;
  • 适合低功耗场景:如电子贺卡、智能玩偶等需长期待机的产品。

4. 电源纹波抑制比(PSRR=50dB)

PSRR衡量放大器对电源波动的抑制能力,50dB意味着:

  • 电源端1V纹波在输出端仅残留约3mV,有效避免电源噪声对音频的干扰;
  • 适配劣质电源/电池供电场景,提升系统稳定性。

三、SOP-8封装与引脚功能说明

LM386DTR采用标准SOP-8贴片封装,引脚定义及功能如下:

引脚号 引脚名称 功能说明 1 GAIN+ 增益调整端(接电阻/电容到8脚,设置增益倍数) 2 IN- 反相输入端(音频信号输入,接前置放大输出) 3 IN+ 同相输入端(通常接0V或分压网络,设置输入偏置) 4 GND 电源地 5 OUT 音频输出端(接耦合电容到扬声器/负载) 6 VCC 电源正输入端(接4V~12V电源,需并联滤波电容) 7 BYPASS 旁路端(接10μF电解电容到地,滤除内部噪声) 8 GAIN- 增益调整端(与1脚配合,设置增益)

关键注意:1脚与8脚之间可接电阻(10kΩ→增益20倍,1kΩ→增益200倍),悬空默认增益10倍;7脚必须接10μF电容,不可省略。

四、典型应用场景

LM386DTR适用于多种低功耗音频场景,核心场景包括:

  1. 便携音频设备:蓝牙音箱、随身听、MP3播放器等,利用宽电压与低功耗优势,兼顾音质与续航;
  2. 玩具与电子礼品:发声玩具、电子贺卡、智能玩偶等,小封装与低成本适合批量生产;
  3. 小型扩音系统:教学扩音器、会议麦克风辅助放大、户外小型喇叭等,高PSRR提升语音清晰度;
  4. 车载音频辅助:车载蓝牙适配器、车载小喇叭等,兼容12V车载电源,无需额外转换;
  5. 教学实验与DIY:电子电路实验、音频DIY项目等,参数明确、设计简单,适合初学者。

五、应用设计注意事项

为保证性能稳定,设计时需注意以下要点:

  1. 电源滤波:VCC(6脚)并联100μF电解电容(滤低频)+0.1μF陶瓷电容(滤高频),靠近芯片放置;
  2. 输出耦合:OUT(5脚)接100μF/16V电解电容到扬声器,避免直流损坏负载;
  3. 增益设置:根据需求选择增益(低增益→1脚8脚悬空,高增益→1脚接1kΩ电阻到8脚);
  4. 旁路电容:BYPASS(7脚)必须接10μF电解电容到地,否则输出噪声显著增加;
  5. 负载匹配:推荐8Ω~32Ω扬声器,负载功率不超过500mW(SOP-8封装散热有限);
  6. 布线规范:输入引脚(2、3)远离输出引脚(5),电源地与信号地分开,减少串扰。

六、产品优势与市场价值

相比同类通用音频功放,LM386DTR(XBLW)具有以下优势:

  • 参数平衡:低THD+N与低Iq的组合,兼顾音质与续航,优于部分普通LM386产品;
  • 品牌可靠性:芯伯乐作为国产优质品牌,产品一致性好,供货稳定,售后保障完善;
  • 成本控制:SOP-8封装适合自动化生产,降低客户生产与物料成本;
  • 设计灵活:宽电压与可调增益,适配多场景,减少方案修改成本。

总结:LM386DTR是一款高性价比的低压音频功率放大器,凭借核心参数优势与灵活应用,成为便携、小体积音频设备的首选方案,覆盖消费电子、玩具、车载等多个领域。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.