Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
XINLUDA XA2214-S14 XA2214
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XINLUDA XA2214-S14
- Type
- XINLUDA
- Minimum package
- 3000 编带
Technical parameters
- P1dB
- 27dBm
- Electronic Component
- Electronic Component
- Electronic Component
- XINLUDA
- Electronic Component
- XA2214-S14
- Electronic Component
- 1
- Package
- SOT-363
- Electronic Component
- RFSwitch
- Electronic Component
- 0.038g
- Frequency
- 50MHz~3GHz
- Electronic Component
- 1
- Electronic Component
- 32dB
- Electronic Component
- BM0228558278
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 1.8V~5.3V
- Electronic Component
- 0.35dB
- Circuit Structure
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XA2214-S14 产品概述
一、产品简介
XA2214-S14是信路达（XINLUDA）推出的一款小型射频前端器件，面向空间受限的移动与无线应用场景。其关键电气性能表现为高隔离度与极低插入损耗，适合用于接收/发射链路的射频切换、隔离或缓冲场合。
二、主要参数
- 隔离度：32 dB（良好的通道抑制能力，减少串扰）
- 插入损耗：0.35 dB（低损耗，保障信号完整性）
- 工作电压：1.8 V ～ 5.3 V（宽电压范围，兼容多种单片机与射频平台）
- 工作温度：-40 ℃ ～ +85 ℃（工业级温度范围）
- 品牌：XINLUDA（信路达）
- 封装：SOT-363（小型表面贴装）
三、封装与可靠性
采用SOT-363小封装，实现器件在有限PCB面积上的高度集成，便于手持设备与嵌入式终端的布局。工作温度覆盖-40～+85℃，满足多数工业与消费级环境下长期可靠性要求。
四、典型应用场景
- 手机与平板的射频前端优化
- 无线通信模块（Wi-Fi、蓝牙、LoRa等）
- GPS/定位接收与天线切换
- IoT终端、智能穿戴及遥测设备的射频路径管理
五、设计注意事项
- 射频链路需做好阻抗匹配（通常为50 Ω）以发挥低插入损耗优势。
- 在电源线上建议增加去耦电容，保证在1.8 V～5.3 V范围内供应稳定。
- 布线时考虑地平面完整性与最短走线以降低辐射与串扰。
- 根据实际应用评估ESD与浪涌保护措施，提升系统可靠性。
六、采购与支持
XA2214-S14由信路达生产，适合对体积、性能与成本有平衡需求的项目。在选型过程中，可向供应商索取完整数据手册与封装尺寸图，以便完成电路与PCB布局验证。
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