WMSIC Electronic Components

XINLUDA XD74LS147

ModelXD74LS147
PackageDIP-16
BrandXINLUDA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XINLUDA XD74LS147
Type
XINLUDA
Minimum package
1000 管装

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINLUDA
Electronic Component
XD74LS147
Electronic Component
1
Package
DIP-16
Type
Encoder
Electronic Component
Signal Switch / Codec / Multiplexer
Electronic Component
1.72g
Electronic Component
1
Electronic Component
BM0228586570
Operating Temperature
0℃~70℃
Operating Voltage
4.75V~5.25V
Power Supply
Power Supply
Current(IOH)
400mA
Current(IOL)
8mA
Static Current(Iq)
62mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XD74LS147 概述

XD74LS147 是信路达(XINLUDA)推出的一款 9 输入至 4 输出的编码器器件,采用传统 TTL 逻辑工艺并封装为 DIP-16。器件适用于需要将多路并行输入编码为二进制输出的场合,具有工作电压范围窄、传输延迟短的特点,适合嵌入式系统、键盘扫描与优先级选择电路等应用。

一、主要特性

  • 类型:编码器(9 输入 / 4 输出)
  • 工作电压:4.75 V ~ 5.25 V(标准 5V TTL 供电)
  • 输出能力:灌电流 IOL = 8 mA;拉电流 IOH = 400 mA(按厂家规格)
  • 工作温度:0 ℃ ~ 70 ℃
  • 传播延迟:tpd = 18 ns(VCC = 5V,CL = 15 pF)
  • 封装:DIP-16(便于面包板和插座安装)
  • 品牌:XINLUDA(信路达)

二、典型应用场景

  • 多路输入至二进制输出的地址/数据压缩
  • 键盘或开关矩阵的优先编码与简化处理
  • 中断管理与优先级检测电路
  • 数字选择器、状态汇总与故障指示器件的信号编码

三、电气特性要点

XD74LS147 在标准 5V 供电下工作,传播延迟在 18 ns 级别,适合中高速数字系统。输出驱动能力注明了灌/拉电流值,设计时应注意每一路输出的负载不应超过器件允许的驱动能力,避免长期过载。实际设计中,接口到后级 CMOS/TTL 器件时,应关注电平兼容性及输入电容(CL),以免显著增加总延迟或造成边沿失真。

四、封装与机械信息

器件提供 DIP-16 插针封装,便于快速原型开发与插板固定。焊接或插装时建议留意散热与空间布置,尽量避免与高功率元件邻近以减少温升对性能的影响。

五、使用建议

  • 供电与去耦:建议在器件 VCC 与 GND 之间并联 0.1 μF 陶瓷去耦电容,靠近引脚放置以抑制高速瞬态噪声。
  • 信号连线:输入端线长尽量短,必要时加缓冲或滤波以提高抗干扰能力;输出驱动大容性负载会增加传播延迟,应评估负载电容对系统时序的影响。
  • 电流限制:设计 PCB 与负载时,应保证单个输出及芯片总体电流不超过器件规格,必要时采用外部三极管或缓冲器分担驱动。
  • 温度与可靠性:工作温度范围为 0–70 ℃,如用于更严苛环境需评估器件可靠性或选择工业级替代件。
  • 数据手册:在进行系统级设计与引脚连接前,请参考详细数据手册确认输入/输出的极性(高/低有效)、内部优先级规则及引脚定义。

六、采购与注意事项

XD74LS147(信路达)DIP-16 封装适合教学、开发和中低量产项目。采购时请确认供应商提供的完整规格书与检验报告,注意同系列或兼容器件在逻辑极性、优先级实现或驱动能力上的差异,以避免因替换器件导致功能异常。

总体而言,XD74LS147 是一款结构简单、易于使用的 9:4 编码器,适合对速度和功耗要求中等的数字系统;合理布线、去耦与负载匹配可确保其在实际电路中稳定可靠运行。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.