WMSIC Electronic Components

XINLUDA XD74LS02

ModelXD74LS02
PackageDIP-14
BrandXINLUDA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XINLUDA XD74LS02
Type
XINLUDA
Minimum package
1000 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINLUDA
Electronic Component
XD74LS02
Electronic Component
1
Package
DIP-14
Electronic Component
Logic Gate
Electronic Component
74LS
Electronic Component
1.63g
Electronic Component
1
Channel Count
4
Electronic Component
BM0228585595
Operating Temperature
0℃~+70℃
Operating Voltage
4.75V~5.25V
Logic Type
Gate
Current(IOH)
400uA
Current(IOL)
8mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XD74LS02 产品概述

一、产品简介

XD74LS02(信路达 XINLUDA)为 74LS 系列四路二输入或非门(Quad 2-input NOR),采用 DIP-14 封装,工作温度范围 0℃~+70℃。该器件按照 TTL 逻辑电平设计,适合传统逻辑电路、接口逻辑与中低速数字系统的逻辑实现与信号整形。

二、主要参数

  • 逻辑类型:或非门(NOR)
  • 通道数:4(每通道为 2 输入)
  • 工作电压:4.75V ~ 5.25V
  • 灌电流 (IOL):8 mA
  • 拉电流 (IOH):400 μA
  • 输入高电平 (VIH):≥ 2.0 V
  • 输入低电平 (VIL):≤ 0.8 V
  • 输出高电平 (VOH):≥ 2.7 V(@ IOH = 400 μA)
  • 输出低电平 (VOL):≤ 0.5 V(@ IOL = 8 mA)
  • 传播延迟 (tpd):标称 12 ms @ 5V、CL = 15 pF(注:资料中该数值可能为笔误,常见 74LS 系列为 ns 级,使用时请以样片实测或厂方数据为准)
  • 工作温度:0℃ ~ +70℃
  • 封装:DIP-14
  • 品牌:XINLUDA(信路达)
  • 描述分类:未分类

三、引脚功能(DIP-14 典型映射)

  • Pin1 A1;Pin2 B1;Pin3 Y1
  • Pin4 A2;Pin5 B2;Pin6 Y2
  • Pin7 GND
  • Pin8 A3;Pin9 B3;Pin10 Y3
  • Pin11 A4;Pin12 B4;Pin13 Y4
  • Pin14 VCC

(与标准 74xx 系列器件引脚排列一致,使用前请确认厂商数据手册引脚图)

四、特点与优势

  • 兼容经典 74LS 电平,适用于 TTL 逻辑系统的直接互联;
  • 四路独立或非门,节省 PCB 空间和器件数量;
  • 标准 DIP-14 便于面包板和原型设计测试;
  • 输出驱动能力足以驱动多个 TTL 输入,适合中等扇出需求的组合逻辑网络。

五、典型应用场景

  • 数字逻辑组合电路(门电路实现)
  • 控制与译码逻辑
  • 报警与检测电路中的条件触发逻辑
  • 教学、原型开发与低速数字系统

六、使用建议与注意事项

  • 去耦:在 VCC 与 GND 之间并联 0.1 μF 陶瓷电容,尽量靠近器件供电脚布置,以减少电源噪声对逻辑稳定性的影响。
  • 未使用输入:74LS 输入不得悬空,未使用时应接至高电平(VCC)或低电平(GND),可通过 10kΩ 左右拉/下拉电阻处理。
  • 扇出:推荐扇出约 10(根据系统实际输入电流与负载条件调整),当需驱动较大电流或多个负载时,建议使用缓冲器或驱动器。
  • 与 CMOS 接口:VOH 最低 2.7V,不能保证驱动所有 CMOS 器件的高电平阈值,若需与 CMOS 直接互联建议使用 74HCT 系列或加上电平转换电路。
  • 负载能力:输出不是开路集电极,驱动 LED、继电器等大电流负载需增加限流/驱动元件,避免超过 IOL/IOH 规格。
  • 传播延迟:资料中标注 12 ms 很可能为误写(通常为 ns 级),在高速或时序敏感系统中应以样品实测或厂方正式手册数据为准。

七、封装与采购

  • 封装形式:DIP-14,适合插装与手工焊接;如需表面贴装可咨询厂商是否有 SOIC 等替代封装。
  • 采购注意:验收时检验外观、引脚无氧化、并建议样片上机测试基础逻辑功能与传播延迟等关键参数,确认满足设计要求。

总结:XD74LS02 为典型 74LS 系列四路二输入或非门器件,适用于传统 TTL 逻辑电路与教学、原型开发场景。设计时注意电源去耦、未用输入处理与与其他逻辑家族匹配问题,遇到高速或 CMOS 接口需求时考虑更适合的系列或添加电平转换与缓冲电路。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.