WMSIC Electronic Components

XINLUDA XL62783

ModelXL62783
PackageSOP-18-300mil
BrandXINLUDA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XINLUDA XL62783
Type
XINLUDA
Minimum package
1000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINLUDA
Electronic Component
XL62783
Electronic Component
1
Package
SOP-18-300mil
Type
MOS
Electronic Component
Darlington Transistor Array
Electronic Component
0.95g
Electronic Component
1
Channel Count
Electronic Component
Electronic Component
BM0228585593
Operating Temperature
40℃~+85℃
Current(Ir)
5uA
(Vf)
2V
Current(on)
0.2mA
Current(off)
3uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL62783 产品概述

一、产品简介

XL62783 是 XINLUDA(信路达)出品的八路达林顿晶体管阵列,封装为 SOP-18-300MIL,适用于多通道低侧开关应用。器件基于达林顿对结构设计,具备较高电流放大能力与低静态功耗的输入特性,适合驱动继电器、指示灯、步进电机驱动单元以及各类小功率执行器和负载。

二、主要参数(概要)

  • 通道数:8 路
  • 最大输入电压 (VI):30 V
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 输入电流(ON):0.2 mA
  • 输入电流(OFF):3 µA
  • 正向压降(Vf):2 V(达林顿集电—发射级典型压降)
  • 反向电流(Ir):5 µA
  • 封装:SOP-18-300MIL

三、功能特性与优势

  • 多通道集成:八路密集集成,便于在单片 PCB 上实现多点驱动,节省空间与器件总数。
  • 低驱动电流:输入 ON 电流仅 0.2 mA,可由微控制器直接驱动,适合资源受限的控制系统。
  • 低关断泄漏:OFF 状态下输入电流与反向电流均较小(3 µA、5 µA),有助于降低静态功耗与误触发风险。
  • 工业级温度范围:-40 ℃ 至 +85 ℃,适应室内外及工业环境应用需求。
  • SOP-18 封装便于常规回流焊工艺装配,适合批量生产。

四、典型应用场景

  • 工业控制板的多路低侧驱动(继电器、接触器小线圈)
  • 家电与仪器仪表中的输出驱动单元(指示灯、蜂鸣器)
  • 步进电机驱动的辅助开关电路与保护电路
  • 多通道开关矩阵、测试夹具的主动驱动接口

五、设计与使用建议

  • 考虑功耗与散热:达林顿结构在饱和导通时具有约 2 V 的压降,负载电流较大时会产生显著功耗(P = Vf × Iload),需评估单通道与器件整体的热耗散并保证器件结温不超标。
  • 感性负载保护:器件说明中未明示内部是否含有反并联二极管或抑制元件,驱动继电器/电机等感性负载时建议外接快速恢复二极管或 TVS 器件进行钳位和浪涌保护。
  • 输入驱动匹配:确保驱动端口能提供至少 0.2 mA 的有效电流以可靠拉入,同时考虑上拉/下拉电阻和输入防抖处理。
  • PCB 布局:将高电流回路走线加粗、靠近器件引脚布置,并在需要处使用散热铜箔或过孔改善热传导。避免敏感模拟信号与开关电流回路并行走线以减少干扰。
  • 参照原厂资料:在设计前应查阅 XL62783 完整数据手册,确认引脚定义、最大额定值、输出电流极限和热阻参数,并依据建议的 PCB 尺寸和封装图进行布局。

六、可靠性与替代考虑

XL62783 适合对成本与通道密度有要求的场合。若应用对导通压降或功耗有更严格要求,可优先考虑单独低饱和晶体管或 MOSFET 驱动方案;若需要内置保护(如限流、钳位或热关断),建议选用带保护功能的专用驱动器或在外围补充相应电路。

总结:XL62783 以其八路集成、低输入电流与工业级工作温度等特性,适合用于中低功率、多通道输出驱动场景。在具体设计中,应重点评估导通压降导致的热耗与对感性负载的保护措施,按数据手册进行电气与热设计确认。

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