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XINLUDA XD2525
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XINLUDA XD2525
- Type
- XINLUDA
- Minimum package
- 25 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XINLUDA
- Electronic Component
- XD2525
- Electronic Component
- 1
- Package
- DIP-16
- Electronic Component
- AC-DC Controllers and Regulators
- Electronic Component
- 1.64g
- Electronic Component
- 1
- Features
- (UVP)
- Electronic Component
- BM0239814479
- Electronic Component
- PWM
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 8V~35V
- Switching Frequency
- 100Hz~400kHz
- Isolation
- Isolated
- Output Current
- 500mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XD2525 产品概述
一、概述
XD2525 是信路达（XINLUDA）推出的一款通用型电源/控制器器件，封装为 DIP-16，适用于中低功率开关电源与 PWM 控制应用。器件支持宽工作电压范围并集成欠压保护与软启动功能，适合工业级与嵌入式系统的电源管理需求。
二、主要规格
- 工作电压：8V ~ 35V
- 最大耗散功率 (Pd)：1000 mW（1 W）
- 最大占空比：49%
- 工作温度范围：-40℃ ~ +85℃
- 典型特性：欠压保护（UVP）、软启动
- 封装：DIP-16
- 品牌：XINLUDA（信路达）
三、功能特性说明
- 欠压保护（UVP）：在输入电压低于安全门限时自动禁止或限制输出，防止器件在不稳定电源下错误工作或损坏负载，适合电池供电或电源纹波较大的场景。
- 软启动：上电时通过限制启动电流和逐步增加输出，降低输入瞬态冲击与输出过冲，保护开关器件和负载，提高系统可靠性。
- 最大占空比 49%：表明在 PWM 控制场景中输出占空比受限，不适用于需要超过 50% 占空比的连续导通应用，适合脉宽受控的降压/升压或隔离型拓扑。
四、典型应用场景
- 中低功耗 DC-DC 开关电源控制器（需满足占空比限制）
- 电池供电设备的电源管理与保护电路
- 工业控制与通信设备的辅助电源
- 开发板与原型验证（DIP-16 便于插装与替换）
五、设计与使用建议
- 电源去耦：在器件电源引脚靠近芯片处放置低 ESR 电解或陶瓷电容，抑制尖峰与噪声，确保 UVP 和软启动动作可靠。
- 占空比限制：在拓扑设计阶段确认工作点占空比不超过 49%，必要时通过外部反馈或补偿电路限制最大占空比。
- 热管理：Pd 为 1 W，若工作在高输入或高环境温度下，应做好散热设计（尽量增大 PCB 铜箔面积或使用外加散热片），并考虑功率和环境温度的降额使用。
- 启动顺序：若系统包含多个电源轨，确保 XD2525 的参考/供电轨具有正确的启动顺序以配合软启动与 UVP 功能。
六、封装与可靠性
DIP-16 插件封装便于手工装配与调试，但散热能力受限，适合实验室与小批量生产。工作温度覆盖 -40℃ 到 +85℃，满足多数工业与民用环境。长期在高温、高负载下使用时应按厂商建议进行热降额。
七、优点与注意事项
优点：宽电压输入、集成欠压保护与软启动、易于原型验证的 DIP-16 封装。
注意事项：1 W 耗散功率限制需要关注散热；49% 的最大占空比限制了某些连续导通或高占空比拓扑的直接使用；具体引脚功能与典型应用电路请参照器件完整数据手册进行最终设计。
综上，XD2525 适合用于对保护与软启动有要求、功耗中等且可接受占空比上限的电源控制场合。实际设计中建议结合完整规格书与热性能数据进行验证与可靠性评估。
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