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XINLUDA XL2981
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- XINLUDA XL2981
- Type
- XINLUDA
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- XINLUDA
- Electronic Component
- XL2981
- Electronic Component
- 1
- Package
- SOP-18-300mil
- Electronic Component
- Darlington Transistor Array
- Electronic Component
- 0.95g
- Electronic Component
- 1
- Channel Count
- Electronic Component
- Electronic Component
- BM0258764220
- Current(Ir)
- 50uA
- (Vf)
- 1.5V
- Current(on)
- 140uA
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
- Collector Current(Icex)
- 200uA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
XL2981 产品概述
一、概述
XL2981（信路达 XINLUDA）是一款八路半导体器件，采用 SOP-18-300mil 封装，适合在紧凑电路板上实现多通道信号驱动或隔离功能。该器件具有较低的开态输入电流与可控的关态漏电流，适用于需要多路并行接口且节能或空间受限的场合。
二、关键参数与意义
- 通道数：8 路，便于多信号并行处理与节省 PCB 空间。
- 集电极-发射极漏电流 (Icex)：200 μA（关态漏电），说明关断时仍有微小泄漏电流，设计上需考虑对上拉或负载电阻的影响。
- 输入电流 (on)：140 μA，为器件进入导通状态时的典型输入驱动电流，表明输入驱动要求较低，有利于微控制器或低功耗电路直接驱动。
- 正向压降 (Vf)：1.5 V，指输入端（如 LED 或二极管）在导通时的电压降，用于计算限流电阻。
- 反向电流 (Ir)：50 μA，表示输入端在反向偏置时的漏电流，应避免长期反向偏置以防影响精度或稳定性。
三、典型电气计算与设计注意事项
- 输入限流电阻计算（示例）：若驱动电压为 5 V，目标输入电流取典型导通值 140 μA，则限流电阻 R = (5 V − Vf) / If ≈ (5 − 1.5) / 0.00014 ≈ 25 kΩ。实际设计可根据速度、噪声裕度选择略小或略大阻值。
- 上拉电阻与漏电流：关态漏电 200 μA 会通过上拉电阻产生压降。若希望上拉电压下降不超过 0.5 V，则上拉阻值应 ≤ 0.5 V / 200 μA ≈ 2.5 kΩ。根据系统逻辑容限选择合适上拉阻值以保证可靠的高电平判定。
- 反向耐受：输入反向电流 50 μA 表明器件不宜承受较高反向电压，应在电路中避免长期或高幅度的反向偏置，并建议在必要处加保护二极管或限压元件。
四、封装与 PCB 布局建议
- 封装为 SOP-18-300mil，适合表贴安装，便于批量生产。
- 布局时注意保持输入/输出通道的走线分离以减少串扰，必要时添加旁路电容或地回路优化。
- 参考厂方推荐的焊盘和热沉要求以避免焊接应力和散热问题。
五、典型应用场景
- 多路微控制器输入/输出隔离或接口扩展。
- 低功耗信号采集与切换场合，尤其是对输入驱动电流要求较低的系统。
- 工业控制与通信设备中需要并行通道但受空间限制的板级设计。
六、选型与可靠性建议
- 在最终设计前应获取并参考厂家的完整数据手册，确认温度特性、极限值及封装尺寸。
- 对于关键应用，建议进行实样测试（温度、老化、电磁兼容性）以验证在目标工况下的表现。
- 如需更低关态漏电或更高抗反向能力，可与供应商沟通替代型号或额外筛选服务。
以上说明基于提供的基础参数整理，实际项目中请结合完整规格书与样品验证以确保设计可靠。
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