WMSIC Electronic Components

XINLUDA XD74LS138

ModelXD74LS138
PackageDIP-16
BrandXINLUDA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XINLUDA XD74LS138
Type
XINLUDA
Minimum package
1000 盒

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINLUDA
Electronic Component
XD74LS138
Electronic Component
1
Package
DIP-16
Type
Decoder
Electronic Component
Signal Switch / Codec / Multiplexer
Electronic Component
1.63g
Electronic Component
1
Electronic Component
BM0228584647
Operating Temperature
0℃~+70℃
Operating Voltage
4.75V~5.25V
Power Supply
Power Supply
Current(IOH)
400uA
Current(IOL)
8mA
(tpd)
41ns@5V,15pF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XD74LS138 产品概述

一、产品概述

XD74LS138(信路达 XINLUDA)为经典的三选八译码器/去码器,采用DIP-16封装,工作电压4.75V~5.25V,工业级温度范围0℃~+70℃。器件将3位二进制输入译码为8路互斥的低电平输出,常用于地址译码、片选、GPIO扩展及现代数字系统的控制逻辑中。该器件保持传统TTL(低功耗肖特基LS)特性,适合与5V逻辑系统直接兼容。

二、主要特性

  • 类型:3-to-8 解码器/译码器(3输入,8输出)
  • 工作电压:4.75V~5.25V(典型5V电源)
  • 输入/输出:3 输入(A、B、C)/8 输出(Y0~Y7)
  • 电流能力:灌电流 IOL = 8mA(低电平有效时),拉电流 IOH = 400µA(高电平源出能力较小)
  • 工作温度:0℃~+70℃(商业温度范围)
  • 封装:DIP-16,易于面包板和模块化开发
  • 输出为有源低(active LOW),通常未选中通道为高电平

三、功能与引脚要点

XD74LS138 通常带有三个地址输入(A、B、C)和三个使能端(一个高电平使能 G1,两个低电平使能 /G2A、/G2B)。只有当使能条件满足时,输入位组合才被译码到相应的低电平输出。器件输出为有源低,因此选中的输出为低电平,其余输出为高电平(高电平为弱源出状态,IOH仅约400µA)。

四、典型应用场景

  • 存储器或外围器件的片选/地址解码
  • 多路选择与地址放大器(微处理器系统)
  • 小规模逻辑扩展(把3位地址扩展为8路控制信号)
  • LED、蜂鸣器等驱动(需注意输出电流限制与外部缓冲)

五、使用注意与设计建议

  • 由于IOH较小(约400µA),输出高电平无法驱动较大负载,高电平状态下如需较大源电流应加上上拉电阻或使用缓冲驱动器(如74LS244、74HC系列驱动器)。
  • 低电平灌电流能力较好(IOL = 8mA),可直接驱动小负载或作为选通信号,但不建议直接驱动大电流器件。
  • 电源稳定性对TTL逻辑尤为重要,PCB上VCC与GND应接近器件引脚布置0.1µF去耦电容以抑制瞬态干扰。
  • 输出为有源低,请在系统设计时注意逻辑极性;若需要正逻辑输出,可在后级加反相器。
  • 避免长走线与高频噪声,必要时在关键信号线上加入RC滤波或阻尼以减少振铃。

六、选型与替代建议

XD74LS138 适合需要与传统TTL逻辑兼容并在5V系统中工作的场景。如需更低功耗或更强的输出驱动能力,可考虑74HC138(CMOS,源/吸电流性能不同)或在输出端加专用驱动器。在批量采购或替换时,关注封装(DIP-16)与温度等级是否匹配系统要求。

总结:XD74LS138 是一款可靠的3-to-8译码器,适合多数5V数字系统的地址译码与控制信号扩展。合理的电流匹配与去耦设计能保证在嵌入式与数字控制系统中稳定运行。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.