WMSIC Electronic Components

XINLUDA XH2576-5.0 XH2576

ModelXH2576-5.0
PackageTO-263-5
BrandXINLUDA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XINLUDA XH2576-5.0
Type
XINLUDA
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINLUDA
Electronic Component
XH2576-5.0
Electronic Component
1
Package
TO-263-5
Electronic Component
DC-DC Power Supply IC
Electronic Component
2.38g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0228561477
Operating Temperature
40℃~+125℃@(TJ)
Operating Voltage
8V~40V
Switching Frequency
52kHz
Electronic Component
Electronic Component
Output Voltage
5V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XH2576-5.0 产品概述

XH2576-5.0 是信路达(XINLUDA)推出的一款降压型 DC-DC 开关稳压器,面向中等功率点的工业与车规类应用。器件为固定 5.0V 输出、单路输出的非同步降压方案,内置开关管,封装为 TO-263-5,可在宽输入电压范围下稳定提供最大 3A 输出电流,静态电流极低,适合对待机损耗有要求的场合。

一、核心特性

  • 功能类型:降压型(Buck)
  • 输入电压范围:8V ~ 40V(器件描述中标称耐压等级与瞬态能力请以数据手册为准)
  • 固定输出电压:5.0V
  • 最大输出电流:3A
  • 开关频率:52 kHz(典型)
  • 同步整流:否(需外接肖特基续流二极管)
  • 静态电流 Iq:约 50 μA(待机耗电低)
  • 开关管:内置 MOSFET
  • 工作结温度范围:-40 ℃ ~ +125 ℃(TJ)
  • 封装:TO-263-5(适合较高功率散热)

二、典型电气参数(概要)

  • 输出通道:1 路,固定 5V 输出
  • 开关频率较低(52kHz),在高输入电压或大电流时能降低开关损耗,但要求器件(电感、电容)体积相对增大以控制纹波
  • 由于为非同步整流结构,需外接低压降、大电流肖特基二极管作为续流器件

三、外部元件与设计要点

  • 续流二极管:选择额定电流 ≥ 3A、耐压至少等于最高输入电压(建议 45V 以上)的低 Vf 肖特基二极管;
  • 电感:因开关频率 52kHz,建议目标电感电流纹波为输出电流的 20%~40%。例如在 Vin=12V、Vout=5V、Iout=3A、纹波 20%(ΔI≈0.6A)条件下,估算 L ≈ 94 μH(仅为示例,最终值需按具体工作点与效率权衡确认);
  • 输出电容:首选低 ESR 的电解/固态电容配合陶瓷旁路,保证瞬态响应与低输出纹波;电容容量与 ESR 对稳压环路稳定性影响较大,建议按数据手册给出的典型值布局;
  • 输入电容与 TVS:输入端应有足够的去耦电容(低 ESR),并在有瞬态或反接风险时加 TVS 与熔断保护;
  • 布局:输入端及开关回路短且粗,续流二极管与电感尽量靠近器件引脚,较大的铜面积或散热片用于 TO-263-5 封装底部散热。

四、热管理与 EMI

  • TO-263-5 提供较好的导热路径,但 3A 输出下仍需关注 PCB 铜箔面积与散热过孔,建议器件底部与散热铜箔连通,并在必要位置布置多组热过孔至背板;
  • 低开关频率有利于减小开关损耗,但电感体积增大,传导、辐射噪声集中在较低频段,需要输入滤波与布局优化来抑制 EMI;
  • 如需更高效率或减小外部器件,考虑使用同步整流方案或更高开关频率的器件替代。

五、典型应用场景

  • 工业电源、仪器仪表供电(8~40V 总线)
  • 汽车电子(满足车载电源总线与宽输入要求时需考虑瞬态与浪涌)
  • 通信设备、嵌入式单板电源模块
  • 需要低静态电流、待机功耗优化的设备

六、选型与注意事项

  • 在系统选型时,务必参考 XH2576-5.0 的完整数据手册,确认瞬态耐压、效率曲线、热阻与保护特性(如是否含过流保护、热关断等);
  • 由于为非同步架构,续流二极管的选择对效率与发热影响显著;若对效率要求较高,应评估同步整流替代方案;
  • 在高温或连续高负载工况下,需校核器件结温并做好 PCB 散热设计,必要时做热仿真与实际测温验证;
  • 在开发阶段建议搭建实际负载测试,验证输出纹波、瞬态响应、过载/短路行为与 EMI 满足系统要求。

总结:XH2576-5.0 是一款适合宽输入、固定 5V 输出、最大 3A 的内置开关管降压器,静态功耗低、封装利于散热。设计时应重视外部续流二极管、电感与滤波电容的选择以及 PCB 热管理与布局,以实现可靠、稳定的电源方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.