WMSIC Electronic Components

XINLUDA XB61040

ModelXB61040
PackageSOT-23-5
BrandXINLUDA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XINLUDA XB61040
Type
XINLUDA
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINLUDA
Electronic Component
XB61040
Electronic Component
1
Package
SOT-23-5
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.072g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0263436283
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
1.8V~6V
Switching Frequency
1MHz
Electronic Component
Electronic Component
Output Voltage
1.8V~28V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XB61040 产品概述

一 产品简介

XB61040 是信路达(XINLUDA)推出的一款升压型开关稳压器,采用升压拓扑、内置开关管、SOT-23-5 封装。工作输入电压范围 1.8V 至 6V,可输出可调电压 1.8V 至 28V,最大输出电流 400mA,开关频率 1MHz,静态电流仅 28µA,工作温度范围 -40℃ 到 +85℃(TA)。该器件面向体积受限且需中等功率输出的便携与嵌入式应用。

二 主要参数一览

  • 功能类型:升压型(Boost)
  • 输入电压:1.8V ~ 6V
  • 输出电压:1.8V ~ 28V(可调)
  • 最大输出电流:400mA
  • 开关频率:1MHz
  • 静态电流(Iq):28µA
  • 同步整流:否(需要外部肖特基二极管)
  • 开关管:内置
  • 输出通道数:1
  • 包装:SOT-23-5
  • 工作温度:-40℃ ~ +85℃(TA)

三 关键特性与优点

  • 低静态电流(28µA),适合电池供电与低功耗待机场景。
  • 1MHz 高频开关利于减小外部电感与电容,便于小型化 PCB 设计。
  • 内置开关管简化布局与设计,只需外置电感、肖特基二极管与滤波电容即可实现升压功能。
  • 输出电压范围宽(1.8V–28V),适用多种外围负载和传感器供电需求。

四 典型应用场景

  • 便携设备(蓝牙设备、便携式仪表)
  • 单节或多节电池升压供电(3.3V、5V、可变高压)
  • 传感器供电与驱动小功率执行器
  • 工业与通信模块的局部升压电源

五 设计与选型建议

  • 外部肖特基二极管:由于非同步整流,建议选择低正向压降的肖特基,Vf 尽量 ≤0.4V,平均电流额定 ≥0.5A。
  • 电感:推荐 1MHz 工作频率下使用 2.2µH–10µH 的功率电感,要求饱和电流高于预计峰值电流(建议留出 1.5–2 倍裕量)。
  • 输入/输出电容:使用低 ESR 陶瓷电容(X5R/X7R),输出侧可采用 10µF–47µF 并联 0.1µF 抑制高频;输入侧加强退耦,靠近 VIN 与 GND。
  • 布局:SW 节点到电感与肖特基的回路应尽量短且宽,以降低 EMI;将 VIN/EN/FB 走线短且远离敏感模拟信号;GND 建议采用完整地平面并安置多个过孔。
  • 热管理:SOT-23-5 封装散热能力有限,高功率输出或高压差工作时需注意器件结温,必要时在 PCB 上扩展散热铜箔并保证空气对流。
  • 保护与稳定性:在设计中关注输入欠压、输出短路与过温保护(若外部系统需要,可在外围增加限流或热关断电路)。

六 常见问题与注意事项

  • 当输出电压接近输入电压或负载接近最大值时,效率会下降并产生较高开关损耗,应评估实际热耗。
  • 若需更高效率或更大输出电流,建议选用同步整流器件以减少整流损耗。
  • 调试时先空载或小负载测量输出和热升,调整反馈网络确保稳态误差与瞬态响应满足系统需求。

如需基于具体电压、电流与效率目标的典型参考电路、外设元件选型(电感型号、肖特基型号、参考电容值)或 PCB 布局示意,可提供工作条件与目标输出,我将给出更详细的设计方案。

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