WMSIC Electronic Components

XINLUDA XL74LS148

ModelXL74LS148
PackageSOP-16
BrandXINLUDA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XINLUDA XL74LS148
Type
XINLUDA
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XINLUDA
Electronic Component
XL74LS148
Electronic Component
1
Package
SOP-16
Type
Encoder
Electronic Component
Signal Switch / Codec / Multiplexer
Electronic Component
0.324g
Electronic Component
1
Electronic Component
BM0230812302
Operating Temperature
0℃~+70℃
Operating Voltage
4.75V~5.25V
Power Supply
Power Supply
Current(IOH)
400mA
Current(IOL)
8mA
Static Current(Iq)
17mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL74LS148 产品概述

一、器件简介

XL74LS148(信路达 XINLUDA)是基于 74LS 家族逻辑实现的编码器芯片,功能上为 8 输入到 3 输出的优先编码器(8-to-3 encoder)。器件以 TTL 电平驱动,供电电压为 4.75V ~ 5.25V,采用 SOP-16 封装,适合用于数字系统中对多路输入信号进行二进制编码并与后级逻辑电路连接。该器件在 0℃~+70℃ 环境下能够可靠工作,适用于商用和一般工业电子设备的控制与地址编码场合。

二、主要参数(按提供信息)

  • 类型:编码器(8 输入 / 3 输出)
  • 工作电压:4.75V ~ 5.25V(典型 TTL 5V 供电)
  • 输入数 / 输出数:8 / 3
  • 灌电流(IOL,sink current):8 mA
  • 拉电流(IOH,source current):400 mA(注:该数值显著高于常见 TTL 输出能力,请在设计中以原厂完整数据手册为准)
  • 工作温度:0℃ ~ +70℃
  • 传播延迟(tpd):25 ns @ 5V,测量条件载荷 15 pF
  • 封装:SOP-16
  • 品牌:XINLUDA(信路达)
  • 描述类别:未分类(通用数字逻辑器件)

三、功能与特性

  • 优先编码功能:对最多 8 路输入信号按照优先级进行编码,输出对应的 3 位二进制码,常用于中断优先级、按键矩阵编码、状态压缩等场景。
  • TTL 兼容:工作在 5V TTL 电平,便于与传统 TTL/CMOS 混合电路接口。
  • 级联扩展能力:常见 74xx148 类器件支持级联(级联输入/输出)以扩展至更多输入通道(具体引脚和时序以厂方数据手册为准)。
  • 节点响应快:在 5V、15 pF 负载条件下,传播延迟约 25 ns,适合一般中高速逻辑应用。

四、典型应用场景

  • 中断控制器与优先级仲裁:将多个中断请求按优先级编码,送入 CPU 或仲裁逻辑。
  • 多路输入压缩:将多路传感器或开关信号压缩为更少的地址/数据线,节省 GPIO 资源。
  • 键盘/按键矩阵前端:对并行检测的按键行信号进行编码,配合扫描逻辑使用。
  • 地址译码与选择逻辑:在地址线或控制信号需要压缩时作为编码前端使用。
  • 通用数字逻辑电路设计中的中间级编码单元。

五、设计与使用注意事项

  • 电源去耦:在 5V 电源端应靠近芯片放置 0.1 μF 陶瓷电容进行旁路滤波,以抑制瞬态和噪声,保证时序可靠性。
  • 电平兼容性:输入端为 TTL 电平;与 3.3V 逻辑直接接口时需确认阈值和上拉策略,避免误判或损坏器件。
  • 输出驱动能力:提供的 IOL = 8 mA 表明器件具有一定的下拉驱动能力,但 IOH=400 mA 的数值异常,应以原厂数据手册为准并避免让输出承受超出常规 TTL 输出能力的大电流负载。
  • 级联与使能:若在系统中进行级联扩展,需按照标准的 74xx148 的级联引脚(使能/级联输入输出)连接并满足时序要求,必要时采用缓冲器隔离以保证电平稳定。
  • 布线与负载:传播延迟随负载电容增大而增大,长 PCB 路径和大电容负载会明显影响速度,尽量减小走线电容并采用合适阻抗匹配或终端阻抗。

六、封装与热管理

  • SOP-16 小型封装,适合表面贴装生产,利于高密度 PCB 设计。
  • 由于器件属于低功耗逻辑芯片,正常工作时发热较小。但在高环境温度或大电流条件下,应注意 PCB 散热设计与周边元件布局,保证工作温度在 0℃ ~ +70℃ 范围内。

七、选型与采购建议

  • 功能匹配:在选型时确认是否需要优先编码(priority encoder)特性和级联接口;若需要更高电压/温度范围或更强驱动能力,可考虑其他系列或添加缓冲驱动器。
  • 数据手册:本概述基于提供的基础参数,建议在设计前下载并严格参照 XINLUDA 的完整数据手册,核对引脚分配、时序、最大额定值和典型特性。
  • 替代与兼容:XL74LS148 与标准 74LS148 逻辑器件在功能上通常兼容,可作为替代,但仍需验证具体参数和引脚对应。

如需,我可以帮您查找并解析该型号的完整数据手册、引脚图或给出电路接法示例与级联方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.