WMSIC Electronic Components

XLSEMI XL6109

ModelXL6109
PackagePDFN-8L(3x3)
BrandXLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XLSEMI XL6109
Type
XLSEMI
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XLSEMI
Electronic Component
XL6109
Electronic Component
1
Package
PDFN-8L(3x3)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.072g
Electronic Component
1
Features
Electronic Component
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0264549583
Operating Temperature
40℃~+125℃
Operating Voltage
2.5V~25V
Switching Frequency
960kHz~1.44MHz
Electronic Component
SEPIC

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL6109 升压型开关稳压器产品概述

一、产品概述

XL6109 是一款高频、内置开关管的升压型 DC-DC 稳压器,采用 SEPIC/升压拓扑,适用于宽输入电压范围的升压或 SEPIC 转换场合。器件工作电压范围宽(2.5V–25V),输出可调(3V–32V),最大输出电流可达 600mA,集成开关管并具备过流保护,便于小体积、高集成度电源设计。

二、主要特点

  • 宽输入电压:2.5V–25V,支持单节锂电池、两节锂电、24V 系统等多种输入源。
  • 输出范围可调:3V–32V,适配多种负载电压需求。
  • 最大输出电流:600mA,适用于中等功率输出应用。
  • 高频工作:开关频率在 960kHz–1.44MHz(标称约 1.2MHz),有利于缩小电感和电容体积。
  • 低静态电流:典型静态电流 Iq = 2.3mA,有利于轻载与待机功耗控制。
  • 集成开关管:内部开关晶体管,简化外部元件选型与布局。
  • 非同步整流:外部肖特基二极管用于整流。
  • 保护功能:具备过流保护,提升系统可靠性。
  • 单路输出,封装为 PDFN-8L (3x3),利于 SMD 组装与热管理。

三、主要电气参数(概要)

  • 输入电压:2.5V–25V
  • 输出电压:3V–32V(可调)
  • 最大输出电流:600mA
  • 开关频率:960kHz–1.44MHz(典型 ~1.2MHz)
  • 静态电流:约 2.3mA
  • 工作温度:-40℃ ~ +125℃
  • 拓扑结构:SEPIC / 升压
  • 同步整流:否(需外接肖特基二极管)
  • 保护:过流保护
  • 封装:PDFN-8L (3x3)

四、典型应用

  • 便携式设备升压电源(单节锂电到高于 5V 电平)
  • 仪器仪表、工业传感器供电(24V 或更高电压生成)
  • LCD 背光、LED 驱动(需配合限流与滤波)
  • 汽车与车载外围电源(注意输入瞬态与抑制)
  • 通信模块、电源管理子系统的升压部分

五、设计建议与注意事项

  • 外部整流选用低正向压降的肖特基二极管以降低损耗。
  • 高频工作使得输入、输出电容需采用低 ESR 类型,保证稳定与纹波控制。
  • SEPIC 结构需要耦合电容、隔离电感等元件,注意电感电流峰值和饱和电流余量。
  • 当输出功率接近器件极限(600mA)时,应重视散热设计,合理铺铜与热盲孔,必要时使用散热片。
  • PCB 布局应尽量缩短高电流回路(开关节点、二极管、输入/输出电容)的环路面积,减少 EMI 与振铃。
  • 选择合适的反馈电阻网络以确保输出稳定,并根据开环特性适当添加补偿元件(如必要)。

六、封装与可靠性

XL6109 提供 PDFN-8L (3x3) 小型封装,适合表面贴装生产。器件工作温度范围 -40℃ 至 +125℃,符合工业级应用需求。器件内置保护机制(过流保护)提高系统可靠性,但在高温或极端工作条件下,应结合外部保护与热管理措施。

如需参考电路、外部元件典型值或布局建议,可提供具体输入/输出参数以便给出更精确的参考设计方案。

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