WMSIC Electronic Components

XLSEMI XL6013E1

ModelXL6013E1
PackageSOP-8
BrandXLSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
XLSEMI XL6013E1
Type
XLSEMI
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
XLSEMI
Electronic Component
XL6013E1
Electronic Component
1
Package
SOP-8
Electronic Component
LEDDriver
Electronic Component
PWM
Electronic Component
0.187g
Electronic Component
1
Channel Count
1
Features
(OVP); Built-in; (OTP)
Electronic Component
BM0264549842
Operating Temperature
40℃~+125℃
Switching Frequency
320kHz~480kHz
Electronic Component
Electronic Component
Operating Voltage(DC)
5V~40V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

XL6013E1 产品概述

一、产品简介

XL6013E1 是芯龙(XLSEMI)推出的一款单通道升压型 LED 驱动芯片,SOP8_150MIL 封装,内置功率开关管,适合从 5V 到 40V 的直流电源工作。芯片采用开关稳压拓扑,通过外部电感与整流二极管实现升压恒流驱动,内置 PWM 调光接口,便于实现亮度控制与串联 LED 的驱动应用。

二、主要电气参数

  • 工作电压(DC):5V ~ 40V
  • 开关频率:320kHz ~ 480kHz(可工作于此频率范围内)
  • 通道数:1(单通道恒流输出)
  • 调光方式:PWM(外部 PWM 信号控制亮度)
  • 工作温度:-40℃ ~ +125℃
  • 开关管:内置功率开关(降低外部器件复杂度)

三、主要功能与保护

  • 过流保护(OCP):当输出或开关电流超过设定阈值时,芯片触发限流或关断以保护器件与负载。
  • 过压保护(OVP):检测输出/反馈异常时采取保护动作,防止 LED 或下游电路承受过高电压。
  • 过温保护(OTP):芯片温度过高时进入保护状态(限流或关断),恢复需等芯片降温。
    这些保护机制提升了系统可靠性,适合要求高可靠性的 LED 驱动场景。

四、设计注意事项

  • 电感选择:选型电感需支持峰值电流且有足够的饱和电流余量(建议 20–30% 余量),低 DCR 有助于提升效率。
  • 整流二极管:采用低正向压降的肖特基二极管,及其反向耐压需高于预期最大输出电压。
  • 输出电容:优先选用低 ESR 电解或固态电容,以降低输出纹波并提升瞬态响应。
  • 电流检测:通过外接取样电阻设定 LED 电流,取样位置尽量靠近芯片引脚,走线短且粗。
  • PWM 调光:PWM 频率与占空比选择应保证不会产生可见频闪,常见取值为几百 Hz 到数 kHz;若用于高频调光需注意 PWM 与开关频率的互相干扰。
  • PCB 布局:关键开关回路(开关管、二极管、电感、电容)应最短回路,散热焊盘与过孔用于热流导出,增加散热能力。

五、典型应用场景

  • 汽车照明(支持 12V/24V 车载电源边界)
  • 室内/商业照明恒流驱动
  • 灯条、背光模组、景观照明以及需要 PWM 调光的 LED 系统

六、封装与热管理

SOP8_150MIL 封装便于手工焊接与常规贴片生产,但封装散热能力有限。高功率或高环境温度下建议:

  • 使用大面积铜箔散热区并加过孔与散热焊盘;
  • 评价时关注封装结温与周围器件热耦合,必要时降低工作电流或改用功率更高的解决方案。

七、评估要点与选型建议

在评估 XL6013E1 时,应关注实际所需 LED 电流与输入/输出电压范围,选择合适的外部电感、肖特基二极管与电容,以实现所需效率与纹波指标。若应用在车载或高温环境,重点验证 OTP 行为与热设计;若需要更高功率或更小封装,可结合系统散热与效率要求比较同类器件后选型。

以上为 XL6013E1 的产品概述与工程应用建议,具体电路参数与引脚功能请参考厂商原始数据手册以获得完整规范和典型应用电路。

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